| Original language | English |
|---|---|
| Pages (from-to) | 211-223 |
| Journal | 2006 IEEE Electriacl Design of Advanced Packaging and System, Shanghai |
| Publication status | Published - 2006 Dec 17 |
Characterization of Radiated Emission by Embedded Decoupling Capacitor in PCB
Toshio Sudo
Research output: Contribution to journal › Article › peer-review