| Original language | English |
|---|---|
| Journal | Asia-pacific EMC Symposium 2011 |
| Publication status | Published - 2011 May 18 |
Cite this
Sakuma, K., & Sudo, T. (2011). Chip-Package-Board Modeling for LCD Driver IC. Asia-pacific EMC Symposium 2011.
Chip-Package-Board Modeling for LCD Driver IC
Koji Sakuma, Toshio Sudo
Research output: Contribution to journal › Article