Chip-Package-Board Modeling for LCD Driver IC

Koji Sakuma, Toshio Sudo

Research output: Contribution to journal › Article

Original languageEnglish
JournalAsia-pacific EMC Symposium 2011
Publication statusPublished - 2011 May 18

Cite this

Chip-Package-Board Modeling for LCD Driver IC. / Sakuma, Koji; Sudo, Toshio.

In: Asia-pacific EMC Symposium 2011, 18.05.2011.

Research output: Contribution to journal › Article

Sakuma, K & Sudo, T 2011, 'Chip-Package-Board Modeling for LCD Driver IC', Asia-pacific EMC Symposium 2011.
Sakuma K, Sudo T. Chip-Package-Board Modeling for LCD Driver IC. Asia-pacific EMC Symposium 2011. 2011 May 18.
Sakuma, Koji ; Sudo, Toshio. / Chip-Package-Board Modeling for LCD Driver IC. In: Asia-pacific EMC Symposium 2011. 2011.
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journal = "Asia-pacific EMC Symposium 2011",

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