Original language | English |
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Journal | Asia-pacific EMC Symposium 2011 |
Publication status | Published - 2011 May 18 |
Cite this
Sakuma, K., & Sudo, T. (2011). Chip-Package-Board Modeling for LCD Driver IC. Asia-pacific EMC Symposium 2011.
Chip-Package-Board Modeling for LCD Driver IC. / Sakuma, Koji; Sudo, Toshio.
In: Asia-pacific EMC Symposium 2011, 18.05.2011.Research output: Contribution to journal › Article
Sakuma, K & Sudo, T 2011, 'Chip-Package-Board Modeling for LCD Driver IC', Asia-pacific EMC Symposium 2011.
Sakuma K, Sudo T. Chip-Package-Board Modeling for LCD Driver IC. Asia-pacific EMC Symposium 2011. 2011 May 18.
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title = "Chip-Package-Board Modeling for LCD Driver IC",
author = "Koji Sakuma and Toshio Sudo",
year = "2011",
month = "5",
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language = "English",
journal = "Asia-pacific EMC Symposium 2011",
}
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JO - Asia-pacific EMC Symposium 2011
JF - Asia-pacific EMC Symposium 2011
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