Chip-Package-Board Modeling for LCD Driver IC

Koji Sakuma, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
JournalAsia-pacific EMC Symposium 2011
Publication statusPublished - 2011 May 18

Cite this

Chip-Package-Board Modeling for LCD Driver IC. / Sakuma, Koji; Sudo, Toshio.

In: Asia-pacific EMC Symposium 2011, 18.05.2011.

Research output: Contribution to journalArticle

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title = "Chip-Package-Board Modeling for LCD Driver IC",
author = "Koji Sakuma and Toshio Sudo",
year = "2011",
month = "5",
day = "18",
language = "English",
journal = "Asia-pacific EMC Symposium 2011",

}

TY - JOUR

T1 - Chip-Package-Board Modeling for LCD Driver IC

AU - Sakuma, Koji

AU - Sudo, Toshio

PY - 2011/5/18

Y1 - 2011/5/18

M3 - Article

JO - Asia-pacific EMC Symposium 2011

JF - Asia-pacific EMC Symposium 2011

ER -