Class I Creep Deformation of Sn-Ag-Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints

Masaki Moriuchi, Yoshiharu Kariya, Mao Kondo, Yoshihiko Kanda

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The creep deformation mechanism of Sn-Ag-Cu alloy doped with Bi and Sb (SACBiSb) alloys is theoretically and experimentally analyzed in order to clarify the effect of solid solution additives in Sn-Ag-Cu alloys. The theoretical prediction results and test results are found to mostly agree with each other. The breakaway stress which is the stress at the transition from Class II to Class I in particular is finely reproduced in the theoretical prediction, with a stress of 25 MPa found both by the prediction and test results. In the stress range where the stress is higher than the breakaway stress, the creep strength of SACBiSb is higher than that of Sn-Ag-Cu, while it was predicted that the creep strength of Sn-Ag-Cu would be superior to that of SACBiSb in the range of stress lower than the breakaway stress. The thermal fatigue life of SACBiSb was predicted to be longer than that of Sn-Ag-Cu in the temperature profile mainly used above the breakaway stress. However, in the temperature profile mainly used in the low-stress range, a reversal of the creep strength between SACBiSb and Sn-Ag-Cu was predicted to occur and the loss of the superiority of SACBiSb in the thermal fatigue life was also predicted.

Original languageEnglish
Pages (from-to)805-812
Number of pages8
JournalMaterials Transactions
Volume63
Issue number6
DOIs
Publication statusPublished - 2022

Keywords

  • BGA
  • Class I creep mechanism
  • Sn-Ag-Cu
  • creep
  • solder
  • solid solution strengthening
  • thermal fatigue

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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