Co-analysis of signal and power integrity of 3D stacked package using flexible printed circuits

Keisuke Ikemiya, Masato Kanazawa, Toshio Sudo, Shizuaki Masuda, Yasushi Hirakawa, Kikuo Wada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three dimensionally stacked package using FFCSP (Flexible carrier Folded real Chip Size Package) has been developed as one solution of high-density DRAM module. FPC (Flexible printed circuit) was effectively utilized to construct the pads at the both top and bottom sides of PoP (package-on-package) structure. In such multi-tiered package structures, the power supply stability for the upper tiered package is estimated to be worse than that of the lower tiered package due to parasitic inductance. In this paper, the co-analysis model including signal integrity (SI) and power integrity (PI) has been established to evaluate the power supply and signal quality among the multi-tiered chips. In particular, the power distribution networks (PDN) and eye diagrams for multi-tiered package were discussed.

Original languageEnglish
Title of host publicationEMC EUROPE 2012 - International Symposium on Electromagnetic Compatibility, Proceedings
DOIs
Publication statusPublished - 2012 Dec 1
EventInternational Symposium on Electromagnetic Compatibility, EMC EUROPE 2012 - Rome, Italy
Duration: 2012 Sep 172012 Sep 21

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

ConferenceInternational Symposium on Electromagnetic Compatibility, EMC EUROPE 2012
CountryItaly
CityRome
Period12/9/1712/9/21

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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    Ikemiya, K., Kanazawa, M., Sudo, T., Masuda, S., Hirakawa, Y., & Wada, K. (2012). Co-analysis of signal and power integrity of 3D stacked package using flexible printed circuits. In EMC EUROPE 2012 - International Symposium on Electromagnetic Compatibility, Proceedings [6396881] (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/EMCEurope.2012.6396881