Compact 60-GHz LTCC stripline parallel-coupled bandpass filter with parasitic elements for millimeter-wave system-on-package

Kenjiro Nishikawa, Tomohiro Seki, Ichihiko Toyoda, Shuji Kubota

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

This paper presents a compact stripline parallelcoupled bandpass filter with parasitic elements on a multilayer LTCC substrate. The parasitic elements are formed above and below the first section and the last section of the filter. These parasitic elements effectively increase the coupling between adjacent parallel lines, resulting in a compact and low loss filter. The proposed filter is fabricated on four layers of a 50-μm LTCC substrate. The intrinsic area of the filter is just 1.6mm by 0.7 mm. A fabricated prototype three-pole bandpass filter chip achieves a center frequency of 59.1 GHz, a bandwidth of 6.9 %, and an insertion loss of 5 dB that includes input and output transitions. The return losses are below -10 dB in the pass band. The figureof-merit of the fabricated bandpass filter is the highest of all reported 60-GHz-band filters even though it has the smallest size. The proposed filter well suits a highly integrated millimeter-wave LTCC system-on-package.

Original languageEnglish
Title of host publicationIEEE MTT-S International Microwave Symposium Digest
Pages1649-1652
Number of pages4
DOIs
Publication statusPublished - 2007
Externally publishedYes
Event2007 IEEE MTT-S International Microwave Symposium, IMS 2007 - Honolulu, HI
Duration: 2007 Jun 32007 Jun 8

Other

Other2007 IEEE MTT-S International Microwave Symposium, IMS 2007
CityHonolulu, HI
Period07/6/307/6/8

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Keywords

  • Bandpass filter
  • LTCC
  • Millimeter-wave
  • Multilayer
  • System-on-package

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Nishikawa, K., Seki, T., Toyoda, I., & Kubota, S. (2007). Compact 60-GHz LTCC stripline parallel-coupled bandpass filter with parasitic elements for millimeter-wave system-on-package. In IEEE MTT-S International Microwave Symposium Digest (pp. 1649-1652). [4264165] https://doi.org/10.1109/MWSYM.2007.380004