Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)H894-H898
JournalJournal of the Electrochemical Society
Volume154
Publication statusPublished - 2007 Oct 1

Cite this

@article{7e3b85747bb848ac821214ec02eebc3c,
title = "Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process",
author = "H. Eto and Homma, {H. Eto;M.Miyazaki;T.Kondo;E.Shiobara;S.Ito;T.}",
year = "2007",
month = "10",
day = "1",
language = "English",
volume = "154",
pages = "H894--H898",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",

}

TY - JOUR

T1 - Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process

AU - Eto, H.

AU - Homma, H. Eto;M.Miyazaki;T.Kondo;E.Shiobara;S.Ito;T.

PY - 2007/10/1

Y1 - 2007/10/1

M3 - Article

VL - 154

SP - H894-H898

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

ER -