| Original language | English |
|---|---|
| Pages (from-to) | H894-H898 |
| Journal | Journal of the Electrochemical Society |
| Volume | 154 |
| Publication status | Published - 2007 Oct 1 |
Cite this
Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process. / Eto, H.; Homma, H. Eto;M.Miyazaki;T.Kondo;E.Shiobara;S.Ito;T.
In: Journal of the Electrochemical Society, Vol. 154, 01.10.2007, p. H894-H898.Research output: Contribution to journal › Article
Eto, H & Homma, HEMMTKESSIT 2007, 'Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process', Journal of the Electrochemical Society, vol. 154, pp. H894-H898.
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title = "Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process",
author = "H. Eto and Homma, {H. Eto;M.Miyazaki;T.Kondo;E.Shiobara;S.Ito;T.}",
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T1 - Comparison of Flow Models for Photoresist Behavior at Contact Holes in Thermal Flow Process
AU - Eto, H.
AU - Homma, H. Eto;M.Miyazaki;T.Kondo;E.Shiobara;S.Ito;T.
PY - 2007/10/1
Y1 - 2007/10/1
M3 - Article
VL - 154
SP - H894-H898
JO - Journal of the Electrochemical Society
JF - Journal of the Electrochemical Society
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