Concurrent reactive ion etching employing micromachined ionic liquid ion source array

Ryo Yoshida; Motoaki Hara; Hiroyuki Oguchi; Tatsuya Suzuki; Hiroki Kuwano

doi:10.1109/MEMSYS.2014.6765677

Concurrent reactive ion etching employing micromachined ionic liquid ion source array

Ryo Yoshida, Motoaki Hara, Hiroyuki Oguchi, Tatsuya Suzuki, Hiroki Kuwano

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper describes concurrent reactive ion etching using micro ionic liquid ion source (ILIS) array. The system consists of micro needle emitters and a reservoir for the ionic liquid (IL) of 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIM]-[BF₄]). The ion beam etching of a (100) silicon substrate using the fabricated ILIS array was demonstrated. As a result of mass spectroscopy during the etching, the peaks of SiF⁺, SiF ₂⁺, and SiF₃⁺ were observed. The chemical reaction between the silicon and fluorine based ions from the IL was confirmed. Also, etching rate of the silicon using the ILIS array applying 5.1 kV ion-acceleration voltage was calculated from the etched dimple on the substrate and was 1.5 times larger than that of a conventional focused Ga ⁺ ion beam applying 30 kV ion-acceleration voltage.

Original language	English
Title of host publication	MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	463-466
Number of pages	4
ISBN (Print)	9781479935086
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765677
Publication status	Published - 2014
Externally published	Yes
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States Duration: 2014 Jan 26 → 2014 Jan 30

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Country/Territory	United States
City	San Francisco, CA
Period	14/1/26 → 14/1/30

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMSYS.2014.6765677

Cite this

Yoshida, R., Hara, M., Oguchi, H., Suzuki, T., & Kuwano, H. (2014). Concurrent reactive ion etching employing micromachined ionic liquid ion source array. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems (pp. 463-466). [6765677] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2014.6765677

Concurrent reactive ion etching employing micromachined ionic liquid ion source array. / Yoshida, Ryo; Hara, Motoaki; Oguchi, Hiroyuki et al.

MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. p. 463-466 6765677 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yoshida, R, Hara, M, Oguchi, H, Suzuki, T & Kuwano, H 2014, Concurrent reactive ion etching employing micromachined ionic liquid ion source array. in MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems., 6765677, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 463-466, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, CA, United States, 14/1/26. https://doi.org/10.1109/MEMSYS.2014.6765677

Yoshida R, Hara M, Oguchi H, Suzuki T, Kuwano H. Concurrent reactive ion etching employing micromachined ionic liquid ion source array. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2014. p. 463-466. 6765677. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2014.6765677

Yoshida, Ryo ; Hara, Motoaki ; Oguchi, Hiroyuki et al. / Concurrent reactive ion etching employing micromachined ionic liquid ion source array. MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 463-466 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{0afff9ad5da44b7d92e198559ec72f98,

title = "Concurrent reactive ion etching employing micromachined ionic liquid ion source array",

abstract = "This paper describes concurrent reactive ion etching using micro ionic liquid ion source (ILIS) array. The system consists of micro needle emitters and a reservoir for the ionic liquid (IL) of 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIM]-[BF4]). The ion beam etching of a (100) silicon substrate using the fabricated ILIS array was demonstrated. As a result of mass spectroscopy during the etching, the peaks of SiF+, SiF 2+, and SiF3+ were observed. The chemical reaction between the silicon and fluorine based ions from the IL was confirmed. Also, etching rate of the silicon using the ILIS array applying 5.1 kV ion-acceleration voltage was calculated from the etched dimple on the substrate and was 1.5 times larger than that of a conventional focused Ga + ion beam applying 30 kV ion-acceleration voltage.",

author = "Ryo Yoshida and Motoaki Hara and Hiroyuki Oguchi and Tatsuya Suzuki and Hiroki Kuwano",

year = "2014",

doi = "10.1109/MEMSYS.2014.6765677",

language = "English",

isbn = "9781479935086",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "463--466",

booktitle = "MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems",

note = "27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 ; Conference date: 26-01-2014 Through 30-01-2014",

}

TY - GEN

T1 - Concurrent reactive ion etching employing micromachined ionic liquid ion source array

AU - Yoshida, Ryo

AU - Hara, Motoaki

AU - Oguchi, Hiroyuki

AU - Suzuki, Tatsuya

AU - Kuwano, Hiroki

PY - 2014

Y1 - 2014

N2 - This paper describes concurrent reactive ion etching using micro ionic liquid ion source (ILIS) array. The system consists of micro needle emitters and a reservoir for the ionic liquid (IL) of 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIM]-[BF4]). The ion beam etching of a (100) silicon substrate using the fabricated ILIS array was demonstrated. As a result of mass spectroscopy during the etching, the peaks of SiF+, SiF 2+, and SiF3+ were observed. The chemical reaction between the silicon and fluorine based ions from the IL was confirmed. Also, etching rate of the silicon using the ILIS array applying 5.1 kV ion-acceleration voltage was calculated from the etched dimple on the substrate and was 1.5 times larger than that of a conventional focused Ga + ion beam applying 30 kV ion-acceleration voltage.

AB - This paper describes concurrent reactive ion etching using micro ionic liquid ion source (ILIS) array. The system consists of micro needle emitters and a reservoir for the ionic liquid (IL) of 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIM]-[BF4]). The ion beam etching of a (100) silicon substrate using the fabricated ILIS array was demonstrated. As a result of mass spectroscopy during the etching, the peaks of SiF+, SiF 2+, and SiF3+ were observed. The chemical reaction between the silicon and fluorine based ions from the IL was confirmed. Also, etching rate of the silicon using the ILIS array applying 5.1 kV ion-acceleration voltage was calculated from the etched dimple on the substrate and was 1.5 times larger than that of a conventional focused Ga + ion beam applying 30 kV ion-acceleration voltage.

UR - http://www.scopus.com/inward/record.url?scp=84899032601&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84899032601&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2014.6765677

DO - 10.1109/MEMSYS.2014.6765677

M3 - Conference contribution

AN - SCOPUS:84899032601

SN - 9781479935086

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 463

EP - 466

BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014

Y2 - 26 January 2014 through 30 January 2014

ER -

Concurrent reactive ion etching employing micromachined ionic liquid ion source array

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