Abstract
High-speed, high-density CMOS VLSI devices have powerful output buffers to charge a load capacitance quickly, which causes large switching noise on the power/ground lines. Furthermore, the equivalent impedance of the output buffer becomes lower than the characteristic impedance of the transmission line on a board, which induces complicated phenomena, including ringing noise. These problems are discussed, and the electrical characteristics of a 348-pin QFP (quad flat package) developed for a 1-micron, 129-K gate CMOS gate array is described. The factors that determine switching noise were investigated by a simulation that represents the packaging environment. A test chip for evaluating the switching noise was designed and used to characterize the 348-pin QFP. Disagreement between measured data and simulation results remains to be investigated.
Original language | English |
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Pages (from-to) | 531-538 |
Number of pages | 8 |
Journal | Proceedings - Electronic Components and Technology Conference |
Publication status | Published - 1989 Dec 1 |
Event | 39th Electronic Components - Houston, TX, USA Duration: 1989 May 22 → 1989 May 24 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering