Constructing a multi-OS platform with minimal engineering cost

Yuki Kinebuchi, Takushi Morita, Kazuo Makijima, Midori Sugaya, Tatsuo Nakajima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

Constructing an embedded device with a real-time and a general-purpose operating system has attracted attention as a promising approach to let the device balance real-time responsiveness and rich functionalities. This paper introduces our methodology for constructing such multi-OS platform with minimal engineering cost by assuming asymmetric OS combinations unique to embedded systems. Our methodology consists of two parts. One is a simple hypervisor for multiplexing resources to be shared between operating systems. The other is modifying operating systems to allow them to be aware of each other. We constructed an experimental system executing TOPPERS and Linux simultaneously on a hardware equipped with an SH-4A processor. The modification to each operating system kernel limited to a few dozen lines of code and do not introduce any overhead that would compromise real-time responsiveness or system throughput.

Original languageEnglish
Title of host publicationIFIP Advances in Information and Communication Technology
PublisherSpringer New York LLC
Pages195-206
Number of pages12
Volume310
ISBN (Print)9783642042836
Publication statusPublished - 2009
Externally publishedYes
Event3rd IFIP TC 10 International Embedded Systems Symposium, IESS 2009 - Langenargen, Germany
Duration: 2009 Sep 142009 Sep 16

Publication series

NameIFIP Advances in Information and Communication Technology
Volume310
ISSN (Print)18684238

Other

Other3rd IFIP TC 10 International Embedded Systems Symposium, IESS 2009
CountryGermany
CityLangenargen
Period09/9/1409/9/16

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ASJC Scopus subject areas

  • Information Systems and Management

Cite this

Kinebuchi, Y., Morita, T., Makijima, K., Sugaya, M., & Nakajima, T. (2009). Constructing a multi-OS platform with minimal engineering cost. In IFIP Advances in Information and Communication Technology (Vol. 310, pp. 195-206). (IFIP Advances in Information and Communication Technology; Vol. 310). Springer New York LLC.