Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

Hideki Yokoi, Tetsuya Mizumoto, Masafumi Shimizu, Takashi Waniishi, Naoki Futakuchi, Noriaki Kaida, Yoshiaki Nakano

Research output: Contribution to journalArticle

Original languageEnglish
JournalThe Electrochemical Society
Publication statusPublished - 1999 Oct 19

Cite this

Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding. / Yokoi, Hideki; Mizumoto, Tetsuya; Shimizu, Masafumi; Waniishi, Takashi; Futakuchi, Naoki; Kaida, Noriaki; Nakano, Yoshiaki.

In: The Electrochemical Society, 19.10.1999.

Research output: Contribution to journalArticle

Yokoi, Hideki ; Mizumoto, Tetsuya ; Shimizu, Masafumi ; Waniishi, Takashi ; Futakuchi, Naoki ; Kaida, Noriaki ; Nakano, Yoshiaki. / Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding. In: The Electrochemical Society. 1999.
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T1 - Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

AU - Yokoi, Hideki

AU - Mizumoto, Tetsuya

AU - Shimizu, Masafumi

AU - Waniishi, Takashi

AU - Futakuchi, Naoki

AU - Kaida, Noriaki

AU - Nakano, Yoshiaki

PY - 1999/10/19

Y1 - 1999/10/19

M3 - Article

JO - The Electrochemical Society

JF - The Electrochemical Society

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