Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

Hideki Yokoi, Tetsuya Mizumoto, Masafumi Shimizu, Takashi Waniishi, Naoki Futakuchi, Noriaki Kaida, Yoshiaki Nakano

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
JournalThe Electrochemical Society
Publication statusPublished - 1999 Oct 19

Cite this