Coupled, macro-micro modeling for hot deformation and sintering

Tatstuhiko Aizawa, Yunan Prawoto, Fujio Tsumori

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

Coupled, macro-micro modeling is proposed to describe hot deformation and sintering behavior of materials at the elevated temperature. Micro-model for description of microstructure evolution is coupled in the hierarchical structure with the macro-model for deformation of structural members or specimens. Owing to the homogenization theory and the selected unit-cell model, hot pressing as well as hipping processes can be quantitatively described by the present method. Direct coupling among the elasto-creep deformation, the thermal transient and the diffusion process enables us to construct the theoretical frame for quantitative description of various material behavior at the elevated temperature. Numerical examples are shown to demonstrate the validity and effectiveness of the present methodology.

Original languageEnglish
Pages (from-to)307-324
Number of pages18
JournalJournal of Computational and Applied Mathematics
Volume149
Issue number1
DOIs
Publication statusPublished - 2002 Dec 1
Externally publishedYes

Fingerprint

Hot working
Macros
Sintering
Computer simulation
Structural members
Hot pressing
Creep
Temperature
Microstructure

Keywords

  • Elasto-creep behavior
  • Homogenization theory
  • Multi-level modeling
  • Thermo-mechanical coupling
  • Unit-cell model

ASJC Scopus subject areas

  • Applied Mathematics
  • Computational Mathematics
  • Numerical Analysis

Cite this

Coupled, macro-micro modeling for hot deformation and sintering. / Aizawa, Tatstuhiko; Prawoto, Yunan; Tsumori, Fujio.

In: Journal of Computational and Applied Mathematics, Vol. 149, No. 1, 01.12.2002, p. 307-324.

Research output: Contribution to journalArticle

Aizawa, Tatstuhiko ; Prawoto, Yunan ; Tsumori, Fujio. / Coupled, macro-micro modeling for hot deformation and sintering. In: Journal of Computational and Applied Mathematics. 2002 ; Vol. 149, No. 1. pp. 307-324.
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