Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

Yoshiharu Kariya, Masahisa Otsuka

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)108-112
Number of pages5
JournalYosetsu Gakkai Shi/Journal of the Japan Welding Society
Volume69
Issue number2
DOIs
Publication statusPublished - 2000
Externally publishedYes

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Soldering
Lead-free solders

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Surfaces, Coatings and Films
  • Metals and Alloys

Cite this

Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly. / Kariya, Yoshiharu; Otsuka, Masahisa.

In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society, Vol. 69, No. 2, 2000, p. 108-112.

Research output: Contribution to journalArticle

@article{71b4fed4b89840bd9c7d3da86556c9ff,
title = "Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly",
author = "Yoshiharu Kariya and Masahisa Otsuka",
year = "2000",
doi = "10.2207/qjjws1943.69.108",
language = "English",
volume = "69",
pages = "108--112",
journal = "Yosetsu Gakkai Shi/Journal of the Japan Welding Society",
issn = "0021-4787",
publisher = "Japan Welding Society",
number = "2",

}

TY - JOUR

T1 - Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

AU - Kariya, Yoshiharu

AU - Otsuka, Masahisa

PY - 2000

Y1 - 2000

UR - http://www.scopus.com/inward/record.url?scp=0038639504&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038639504&partnerID=8YFLogxK

U2 - 10.2207/qjjws1943.69.108

DO - 10.2207/qjjws1943.69.108

M3 - Article

AN - SCOPUS:0038639504

VL - 69

SP - 108

EP - 112

JO - Yosetsu Gakkai Shi/Journal of the Japan Welding Society

JF - Yosetsu Gakkai Shi/Journal of the Japan Welding Society

SN - 0021-4787

IS - 2

ER -