Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

Yoshiharu Kariya, Masahisa Otsuka

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)108-112
Number of pages5
JournalYosetsu Gakkai Shi/Journal of the Japan Welding Society
Volume69
Issue number2
DOIs
Publication statusPublished - 2000 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Surfaces, Coatings and Films
  • Metals and Alloys

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