Degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H. Aoki, S. Yamasaki, T. Usami, Y. Tsuchiya, N. Ito, T. Onodera, Y. Hayashi, K. Ueno, H. Gomi, N. Aoto

Research output: Contribution to journalConference articlepeer-review

8 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science

Physics & Astronomy