Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA

Moe Nozaki, Yoshiharu Kariya, Yoshiyuki Hiroshima, Nobuo Taketomi, Kenichi Ohashi, Kenichi Tomioka, Shunichi Kikuchi, Jack Tan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Engineering & Materials Science

Chemical Compounds