Design of electrostatic adhesion device using the flexible electrodes

Akifumi Takada, Shingo Nakamura, Yoko Yamanishi, Shinji Hashimura, Sumito Nagasawa, Takanobu Kogure, Shingo Maeda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.

Original languageEnglish
Title of host publication2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479966790
DOIs
Publication statusPublished - 2015 Jan 9
Event2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 - Nagoya, Japan
Duration: 2014 Nov 102014 Nov 12

Other

Other2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
CountryJapan
CityNagoya
Period14/11/1014/11/12

Fingerprint

Electrostatic force
Electrostatics
Adhesion
Electrodes
Electric charge
Tensile testing
Biomimetics
Spraying
Carbon black
Surface structure
Rubber
Capacitors
Electricity
Fabrication
Silicon
Experiments

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Takada, A., Nakamura, S., Yamanishi, Y., Hashimura, S., Nagasawa, S., Kogure, T., & Maeda, S. (2015). Design of electrostatic adhesion device using the flexible electrodes. In 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 [7006081] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2014.7006081

Design of electrostatic adhesion device using the flexible electrodes. / Takada, Akifumi; Nakamura, Shingo; Yamanishi, Yoko; Hashimura, Shinji; Nagasawa, Sumito; Kogure, Takanobu; Maeda, Shingo.

2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc., 2015. 7006081.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takada, A, Nakamura, S, Yamanishi, Y, Hashimura, S, Nagasawa, S, Kogure, T & Maeda, S 2015, Design of electrostatic adhesion device using the flexible electrodes. in 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014., 7006081, Institute of Electrical and Electronics Engineers Inc., 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014, Nagoya, Japan, 14/11/10. https://doi.org/10.1109/MHS.2014.7006081
Takada A, Nakamura S, Yamanishi Y, Hashimura S, Nagasawa S, Kogure T et al. Design of electrostatic adhesion device using the flexible electrodes. In 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc. 2015. 7006081 https://doi.org/10.1109/MHS.2014.7006081
Takada, Akifumi ; Nakamura, Shingo ; Yamanishi, Yoko ; Hashimura, Shinji ; Nagasawa, Sumito ; Kogure, Takanobu ; Maeda, Shingo. / Design of electrostatic adhesion device using the flexible electrodes. 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc., 2015.
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