Abstract
This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.
| Original language | English |
|---|---|
| Title of host publication | 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Print) | 9781479966790 |
| DOIs | |
| Publication status | Published - 2015 Jan 9 |
| Event | 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 - Nagoya, Japan Duration: 2014 Nov 10 → 2014 Nov 12 |
Other
| Other | 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 |
|---|---|
| Country | Japan |
| City | Nagoya |
| Period | 14/11/10 → 14/11/12 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
Cite this
Design of electrostatic adhesion device using the flexible electrodes. / Takada, Akifumi; Nakamura, Shingo; Yamanishi, Yoko; Hashimura, Shinji; Nagasawa, Sumito; Kogure, Takanobu; Maeda, Shingo.
2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc., 2015. 7006081.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Design of electrostatic adhesion device using the flexible electrodes
AU - Takada, Akifumi
AU - Nakamura, Shingo
AU - Yamanishi, Yoko
AU - Hashimura, Shinji
AU - Nagasawa, Sumito
AU - Kogure, Takanobu
AU - Maeda, Shingo
PY - 2015/1/9
Y1 - 2015/1/9
N2 - This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.
AB - This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.
UR - http://www.scopus.com/inward/record.url?scp=84961381681&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84961381681&partnerID=8YFLogxK
U2 - 10.1109/MHS.2014.7006081
DO - 10.1109/MHS.2014.7006081
M3 - Conference contribution
AN - SCOPUS:84961381681
SN - 9781479966790
BT - 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
ER -