Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

S. N. David Chua, S. Mohamaddan, S. J. Tanjong, A. Yassin, S. F. Lim

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Deployment of an automatic visual inspection system in semiconductor industry has become increasingly popular than ever not only due to its relatively high value as a yield analysis tool of outgoing products but more importantly for the prevention of defect escapee. A lot of studies are done on the application of in-line defect scan but the application of outgoing wafer inspection at post-fab environment has been very limited and rarely found in literature. With rapid growth of automotive application in worldwide industry, the importance of quality of the wafer at die level has never been so critical. This paper provides a method for detection of bond pad discolorations at outgoing quality check especially in semiconductor industry. An effective method for detection of the bond pad discolorations was proposed. The advantages and disadvantages of the detection method are discussed. Factors that are affecting the performances of the detection method are also described and analyzed.

Original languageEnglish
Article number8103795
Pages (from-to)144-148
Number of pages5
JournalIEEE Transactions on Semiconductor Manufacturing
Volume31
Issue number1
DOIs
Publication statusPublished - 2018 Feb
Externally publishedYes

Keywords

  • bond pad
  • discoloration
  • inspection
  • outgoing
  • Polyimide
  • wafer

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Detection of Bond Pad Discolorations at Outgoing Wafer Inspections'. Together they form a unique fingerprint.

  • Cite this