Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure

Yumi Inoue, Tsutomu Nakazawa, Kanako Sawada, Toshio Sudo

Research output: Contribution to conferencePaper

Abstract

Package cracking during reflow soldering is a critical issue for the reliability of plastic encapsulated semiconductor devices. In the case of a conventional package structure, the adhesion strength at the interface between the metal die-pad and the resin drops rapidly for high temperature and humidity. This is a major cause of package cracking. So, a new packaging structure, the chip side support (CSS) structure was introduced. The reliability of the CSS structure package was evaluated by executing the adhesion strength measurement of the interface in the packages, reflow soldering test, temperature cycle test (TCT) and high humidity storage test. The results of these tests indicated that the CSS structure package was superior to conventional packages. The CSS structure package realizes a crack-free package without moisture-proof packing by dispensing with the die-pad and adopting a thinner package thickness.

Original languageEnglish
Pages407-410
Number of pages4
Publication statusPublished - 1995 Dec 1
EventProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn
Duration: 1995 Dec 41995 Dec 6

Other

OtherProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology
CityOmiya, Jpn
Period95/12/495/12/6

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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    Inoue, Y., Nakazawa, T., Sawada, K., & Sudo, T. (1995). Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure. 407-410. Paper presented at Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, Omiya, Jpn, .