Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure

Yumi Inoue, Tsutomu Nakazawa, Kanako Sawada, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Package cracking during reflow soldering is a critical issue for the reliability of plastic encapsulated semiconductor devices. In the case of a conventional package structure, the adhesion strength at the interface between the metal die-pad and the resin drops rapidly for high temperature and humidity. This is a major cause of package cracking. So, a new packaging structure, the chip side support (CSS) structure was introduced. The reliability of the CSS structure package was evaluated by executing the adhesion strength measurement of the interface in the packages, reflow soldering test, temperature cycle test (TCT) and high humidity storage test. The results of these tests indicated that the CSS structure package was superior to conventional packages. The CSS structure package realizes a crack-free package without moisture-proof packing by dispensing with the die-pad and adopting a thinner package thickness.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages407-410
Number of pages4
Publication statusPublished - 1995
EventProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn
Duration: 1995 Dec 41995 Dec 6

Other

OtherProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology
CityOmiya, Jpn
Period95/12/495/12/6

Fingerprint

Bond strength (materials)
Soldering
Atmospheric humidity
Plastics
Cracks
Bearing pads
Semiconductor devices
Packaging
Moisture
Resins
Temperature
Metals

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Inoue, Y., Nakazawa, T., Sawada, K., & Sudo, T. (1995). Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure. In Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium (pp. 407-410). Piscataway, NJ, United States: IEEE.

Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure. / Inoue, Yumi; Nakazawa, Tsutomu; Sawada, Kanako; Sudo, Toshio.

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States : IEEE, 1995. p. 407-410.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Inoue, Y, Nakazawa, T, Sawada, K & Sudo, T 1995, Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure. in Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. IEEE, Piscataway, NJ, United States, pp. 407-410, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, Omiya, Jpn, 95/12/4.
Inoue Y, Nakazawa T, Sawada K, Sudo T. Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure. In Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States: IEEE. 1995. p. 407-410
Inoue, Yumi ; Nakazawa, Tsutomu ; Sawada, Kanako ; Sudo, Toshio. / Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure. Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States : IEEE, 1995. pp. 407-410
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