Development of lead free solder alloy for flip chip application

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2003 Dec 1

Cite this

Development of lead free solder alloy for flip chip application. / Kariya, Yoshiharu.

In: Default journal, 01.12.2003.

Research output: Contribution to journalArticle

@article{53efad3fc5534b73ae34f90a2b731be5,
title = "Development of lead free solder alloy for flip chip application",
author = "Yoshiharu Kariya",
year = "2003",
month = "12",
day = "1",
language = "English",
journal = "Default journal",

}

TY - JOUR

T1 - Development of lead free solder alloy for flip chip application

AU - Kariya, Yoshiharu

PY - 2003/12/1

Y1 - 2003/12/1

M3 - Article

JO - Default journal

JF - Default journal

ER -