Development of technology for a reliable fabrication of LRE-123 materials for levitation applications above 80 K

M. Muralidhar, N. Sakai, M. Jirsa, M. Murakami, N. Koshizuka, I. Hirabayashi

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

Nanoscale secondary phase Gd2BaCuO5 "Gd-211" particles less than 60 nm in size, added to mixed ternary LREBa2Cu3Oy [LRE = (Nd0.33Eu 0.33Gd0.33), (Sm0.33Eu0.33Gd 0.33), (Nd0.33Sm0.33Gd0.33)] "NEG-123, SEG-123, NSG-123" oxide powders and melt-processed in Ar-1%pO2 gas mixture, significantly improve electromagnetic performance at low magnetic fields. As confirmed by transmission electron microscopy and dynamic force microscopy, the nanoparticles in the LRE-123 matrix not only survive the melt-texturing process but, thanks to their contamination by Zr coming from ball milling process, these particles in majority transform into a new type of even smaller defects. Further improvement in flux pinning was reached when both 123 and 211 powders were thoroughly ball milled before the melt-growth process to the similar small size. As a result, Jc values of 260 kA/cm2 and 55 kA/cm2 were observed in remnant state at 77 K and 90 K, respectively.

Original languageEnglish
Pages (from-to)777-782
Number of pages6
JournalPhysica C: Superconductivity and its applications
Volume426-431
Issue numberI
DOIs
Publication statusPublished - 2005 Oct 1
EventProceedings of the 17th International Symposium on Superconductivity (ISS 2004) Advances in Supeconductivity -
Duration: 2004 Nov 232004 Nov 25

Keywords

  • Critical current density (J)
  • Flux pinning
  • LRE-123 melt textured compounds
  • Levitation at 90.2 K
  • Microstructure

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Development of technology for a reliable fabrication of LRE-123 materials for levitation applications above 80 K'. Together they form a unique fingerprint.

Cite this