Displacement magnification of gel actuator using pNIPAAm-SU8 hybrid structure

Takanobu Kogure, Ryoya Okada, Shingo Maeda, Sumito Nagasawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a fabrication method for a hybrid structure of the poly-N-Isopropylacrylamide (pNIPAAm) gel as a soft material and the SU-8 as a solid material is proposed. This pNIPAAm-SU8 hybrid structure can be applied to various applications such as gel actuators. These hybrid structures have a serious problem that it is easily broken by the difference of swelling rate. Our proposed hybrid structure was not broken though repeating swelling-shrinking states for 10 or more times. A small displacement of the gel is occurred by the phase transition, then it is magnified by combining with the SU-8 solid structure. We demonstrated that the expanded tip displacement of the SU-8 solid structure reached 145μm.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1082-1085
Number of pages4
Volume2015-February
EditionFebruary
DOIs
Publication statusPublished - 2015 Feb 26
Event2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015 - Estoril, Portugal
Duration: 2015 Jan 182015 Jan 22

Other

Other2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
CountryPortugal
CityEstoril
Period15/1/1815/1/22

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Kogure, T., Okada, R., Maeda, S., & Nagasawa, S. (2015). Displacement magnification of gel actuator using pNIPAAm-SU8 hybrid structure. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (February ed., Vol. 2015-February, pp. 1082-1085). [7051151] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2015.7051151