Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy

Kentarou Atsumi, Yoshiharu Kariya, Masahisa Ostuka

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 1999 Feb 1

Cite this

Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy. / Atsumi, Kentarou; Kariya, Yoshiharu; Ostuka, Masahisa.

In: Default journal, 01.02.1999.

Research output: Contribution to journalArticle

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author = "Kentarou Atsumi and Yoshiharu Kariya and Masahisa Ostuka",
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AU - Atsumi, Kentarou

AU - Kariya, Yoshiharu

AU - Ostuka, Masahisa

PY - 1999/2/1

Y1 - 1999/2/1

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