| Original language | English |
|---|---|
| Journal | Default journal |
| Publication status | Published - 1999 Feb 1 |
Cite this
Atsumi, K., Kariya, Y., & Ostuka, M. (1999). Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy. Default journal.
Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy. / Atsumi, Kentarou; Kariya, Yoshiharu; Ostuka, Masahisa.
In: Default journal, 01.02.1999.Research output: Contribution to journal › Article
Atsumi, K, Kariya, Y & Ostuka, M 1999, 'Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy', Default journal.
Atsumi K, Kariya Y, Ostuka M. Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy. Default journal. 1999 Feb 1.
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author = "Kentarou Atsumi and Yoshiharu Kariya and Masahisa Ostuka",
year = "1999",
month = "2",
day = "1",
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T1 - Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy
AU - Atsumi, Kentarou
AU - Kariya, Yoshiharu
AU - Ostuka, Masahisa
PY - 1999/2/1
Y1 - 1999/2/1
M3 - Article
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JF - Default journal
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