| Original language | English |
|---|---|
| Journal | Default journal |
| Publication status | Published - 1999 Feb 1 |
Cite this
Atsumi, K., Kariya, Y., & Ostuka, M. (1999). Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy. Default journal.
Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy
Kentarou Atsumi, Yoshiharu Kariya, Masahisa Ostuka
Research output: Contribution to journal › Article