Effect of Bismuth on the Isoｔhermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	171-176
Journal	Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials
Publication status	Published - 1998 Jul 1

Cite this

@article{d0bace7e1ba84a9c98ca8a7a9bf04b14,

title = "Effect of Bismuth on the Isoｔhermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy",

author = "Yoshiharu Kariya and Masahisa Otsuka",

year = "1998",

month = jul,

day = "1",

language = "English",

pages = "171--176",

journal = "Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials",

}

TY - JOUR

T1 - Effect of Bismuth on the Isoｔhermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy

AU - Kariya, Yoshiharu

AU - Otsuka, Masahisa

PY - 1998/7/1

Y1 - 1998/7/1

M3 - Article

SP - 171

EP - 176

JO - Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials

JF - Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials

ER -