The standard electrode potential for Cu is 0.34 V and that of In is -0.34 V, which means that their deposition potentials are far apart, making the co-deposition difficult from a simple solution containing Cu and In ions. In order to bring these deposition potentials closer, a complex forming reagent of citric or EDTA is added to the CuSO4-In2(SO4)3 solution. The effect of these reagents was examined by linear sweep voltammetric measurement. An electrochemical deposition experiment of Cu-In alloy was conducted where effect citric acid or EDTA addition, current density and Cu concentration were examined.
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