Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition

Takahiro Ishizaki, Nagahiro Saito, Akio Fuwa

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The standard electrode potential for Cu is 0.34 V and that of In is -0.34 V, which means that their deposition potentials are far apart, making the co-deposition difficult from a simple solution containing Cu and In ions. In order to bring these deposition potentials closer, a complex forming reagent of citric or EDTA is added to the CuSO4-In2(SO4)3 solution. The effect of these reagents was examined by linear sweep voltammetric measurement. An electrochemical deposition experiment of Cu-In alloy was conducted where effect citric acid or EDTA addition, current density and Cu concentration were examined.

Original languageEnglish
Pages (from-to)867-870
Number of pages4
Journalmaterials transactions, jim
Volume40
Issue number9
Publication statusPublished - 1999
Externally publishedYes

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ethylenediaminetetraacetic acids
citric acid
Ethylenediaminetetraacetic acid
Citric acid
Edetic Acid
Citric Acid
reagents
Current density
Ions
current density
Electrodes
electrodes
ions
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition. / Ishizaki, Takahiro; Saito, Nagahiro; Fuwa, Akio.

In: materials transactions, jim, Vol. 40, No. 9, 1999, p. 867-870.

Research output: Contribution to journalArticle

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