Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Yoshihiko Kanda; Yuji Oto; Yusuke Shiigi; Yoshiharu Kariya

doi:10.1115/IPACK2011-52107

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Yoshihiko Kanda, Yuji Oto, Yusuke Shiigi, Yoshiharu Kariya

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.

Original language	English
Title of host publication	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages	713-718
Number of pages	6
DOIs	https://doi.org/10.1115/IPACK2011-52107
Publication status	Published - 2011 Dec 1
Event	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States Duration: 2011 Jul 6 → 2011 Jul 8

Publication series

Name	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume	2

Conference

Conference	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Country	United States
City	Portland, OR
Period	11/7/6 → 11/7/8

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ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

Kanda, Y., Oto, Y., Shiigi, Y., & Kariya, Y. (2011). Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 713-718). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2). https://doi.org/10.1115/IPACK2011-52107

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. / Kanda, Yoshihiko; Oto, Yuji; Shiigi, Yusuke; Kariya, Yoshiharu.

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. p. 713-718 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kanda, Y, Oto, Y, Shiigi, Y & Kariya, Y 2011, Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, vol. 2, pp. 713-718, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, Portland, OR, United States, 11/7/6. https://doi.org/10.1115/IPACK2011-52107

Kanda Y, Oto Y, Shiigi Y, Kariya Y. Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. p. 713-718. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011). https://doi.org/10.1115/IPACK2011-52107

Kanda, Yoshihiko ; Oto, Yuji ; Shiigi, Yusuke ; Kariya, Yoshiharu. / Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. pp. 713-718 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011).

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abstract = "The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.",

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N2 - The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.

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Access to Document

10.1115/IPACK2011-52107