Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Yoshihiko Kanda, Yuji Oto, Yusuke Shiigi, Yoshiharu Kariya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.

Original languageEnglish
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages713-718
Number of pages6
Volume2
DOIs
Publication statusPublished - 2011
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR
Duration: 2011 Jul 62011 Jul 8

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CityPortland, OR
Period11/7/611/7/8

Fingerprint

Strain hardening
Ductility
Fatigue of materials
Solid solutions
Soldering alloys
Intermetallics
Creep
Grain boundaries
Particle size
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kanda, Y., Oto, Y., Shiigi, Y., & Kariya, Y. (2011). Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (Vol. 2, pp. 713-718) https://doi.org/10.1115/IPACK2011-52107

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. / Kanda, Yoshihiko; Oto, Yuji; Shiigi, Yusuke; Kariya, Yoshiharu.

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2 2011. p. 713-718.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kanda, Y, Oto, Y, Shiigi, Y & Kariya, Y 2011, Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. vol. 2, pp. 713-718, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, Portland, OR, 11/7/6. https://doi.org/10.1115/IPACK2011-52107
Kanda Y, Oto Y, Shiigi Y, Kariya Y. Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2. 2011. p. 713-718 https://doi.org/10.1115/IPACK2011-52107
Kanda, Yoshihiko ; Oto, Yuji ; Shiigi, Yusuke ; Kariya, Yoshiharu. / Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2 2011. pp. 713-718
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