Abstract
The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.
| Original language | English |
|---|---|
| Title of host publication | ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 |
| Pages | 713-718 |
| Number of pages | 6 |
| Volume | 2 |
| DOIs | |
| Publication status | Published - 2011 |
| Event | ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR Duration: 2011 Jul 6 → 2011 Jul 8 |
Other
| Other | ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 |
|---|---|
| City | Portland, OR |
| Period | 11/7/6 → 11/7/8 |
Fingerprint
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. / Kanda, Yoshihiko; Oto, Yuji; Shiigi, Yusuke; Kariya, Yoshiharu.
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2 2011. p. 713-718.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy
AU - Kanda, Yoshihiko
AU - Oto, Yuji
AU - Shiigi, Yusuke
AU - Kariya, Yoshiharu
PY - 2011
Y1 - 2011
N2 - The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.
AB - The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.
UR - http://www.scopus.com/inward/record.url?scp=84860336976&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860336976&partnerID=8YFLogxK
U2 - 10.1115/IPACK2011-52107
DO - 10.1115/IPACK2011-52107
M3 - Conference contribution
AN - SCOPUS:84860336976
SN - 9780791844618
VL - 2
SP - 713
EP - 718
BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
ER -