Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Yoshiharu Kariya, Kana Sato, Shota Asari, Yoshihiko Kanda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.

Original languageEnglish
Title of host publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOIs
Publication statusPublished - 2010
Event2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV
Duration: 2010 Jun 22010 Jun 5

Other

Other2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
CityLas Vegas, NV
Period10/6/210/6/5

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Keywords

  • Fracture
  • Lead-free solder
  • Low-cycle fatigue
  • Microstructure
  • Miniature testing
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kariya, Y., Sato, K., Asari, S., & Kanda, Y. (2010). Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint. In 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 [5501298] https://doi.org/10.1109/ITHERM.2010.5501298