@inproceedings{05f537a505b24073a0ab75dd3829d7cd,
title = "Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint",
abstract = "The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.",
keywords = "Fracture, Lead-free solder, Low-cycle fatigue, Microstructure, Miniature testing, Sn-Ag-Cu",
author = "Yoshiharu Kariya and Kana Sato and Shota Asari and Yoshihiko Kanda",
year = "2010",
month = aug,
day = "9",
doi = "10.1109/ITHERM.2010.5501298",
language = "English",
isbn = "9781424453429",
series = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
note = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 ; Conference date: 02-06-2010 Through 05-06-2010",
}