Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Yoshiharu Kariya, Kana Sato, Shota Asari, Yoshihiko Kanda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.

Original languageEnglish
Title of host publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOIs
Publication statusPublished - 2010
Event2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV
Duration: 2010 Jun 22010 Jun 5

Other

Other2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
CityLas Vegas, NV
Period10/6/210/6/5

Fingerprint

Crack initiation
Soldering alloys
Fatigue of materials
Crack propagation

Keywords

  • Fracture
  • Lead-free solder
  • Low-cycle fatigue
  • Microstructure
  • Miniature testing
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kariya, Y., Sato, K., Asari, S., & Kanda, Y. (2010). Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint. In 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 [5501298] https://doi.org/10.1109/ITHERM.2010.5501298

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint. / Kariya, Yoshiharu; Sato, Kana; Asari, Shota; Kanda, Yoshihiko.

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 2010. 5501298.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kariya, Y, Sato, K, Asari, S & Kanda, Y 2010, Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint. in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010., 5501298, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010, Las Vegas, NV, 10/6/2. https://doi.org/10.1109/ITHERM.2010.5501298
Kariya Y, Sato K, Asari S, Kanda Y. Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint. In 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 2010. 5501298 https://doi.org/10.1109/ITHERM.2010.5501298
Kariya, Yoshiharu ; Sato, Kana ; Asari, Shota ; Kanda, Yoshihiko. / Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint. 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 2010.
@inproceedings{05f537a505b24073a0ab75dd3829d7cd,
title = "Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint",
abstract = "The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.",
keywords = "Fracture, Lead-free solder, Low-cycle fatigue, Microstructure, Miniature testing, Sn-Ag-Cu",
author = "Yoshiharu Kariya and Kana Sato and Shota Asari and Yoshihiko Kanda",
year = "2010",
doi = "10.1109/ITHERM.2010.5501298",
language = "English",
isbn = "9781424453429",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",

}

TY - GEN

T1 - Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

AU - Kariya, Yoshiharu

AU - Sato, Kana

AU - Asari, Shota

AU - Kanda, Yoshihiko

PY - 2010

Y1 - 2010

N2 - The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.

AB - The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.

KW - Fracture

KW - Lead-free solder

KW - Low-cycle fatigue

KW - Microstructure

KW - Miniature testing

KW - Sn-Ag-Cu

UR - http://www.scopus.com/inward/record.url?scp=77955200815&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955200815&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2010.5501298

DO - 10.1109/ITHERM.2010.5501298

M3 - Conference contribution

AN - SCOPUS:77955200815

SN - 9781424453429

BT - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

ER -