Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages684-688
Number of pages5
DOIs
Publication statusPublished - 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV
Duration: 2007 May 292007 Jun 1

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CitySparks, NV
Period07/5/2907/6/1

Fingerprint

Fatigue of materials
Bending tests
Crack propagation
Temperature
Substrates
Lead-free solders

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kobayashi, T., Kariya, Y., Sasaki, T., Tanaka, M., & Tatsumi, K. (2007). Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. In Proceedings - Electronic Components and Technology Conference (pp. 684-688). [4249956] https://doi.org/10.1109/ECTC.2007.373870

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. / Kobayashi, Takayuki; Kariya, Yoshiharu; Sasaki, Tsutomu; Tanaka, Masamoto; Tatsumi, Kohei.

Proceedings - Electronic Components and Technology Conference. 2007. p. 684-688 4249956.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kobayashi, T, Kariya, Y, Sasaki, T, Tanaka, M & Tatsumi, K 2007, Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. in Proceedings - Electronic Components and Technology Conference., 4249956, pp. 684-688, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, 07/5/29. https://doi.org/10.1109/ECTC.2007.373870
Kobayashi T, Kariya Y, Sasaki T, Tanaka M, Tatsumi K. Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. In Proceedings - Electronic Components and Technology Conference. 2007. p. 684-688. 4249956 https://doi.org/10.1109/ECTC.2007.373870
Kobayashi, Takayuki ; Kariya, Yoshiharu ; Sasaki, Tsutomu ; Tanaka, Masamoto ; Tatsumi, Kohei. / Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. Proceedings - Electronic Components and Technology Conference. 2007. pp. 684-688
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