Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages684-688
Number of pages5
DOIs
Publication statusPublished - 2007 Oct 22
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 2007 May 292007 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period07/5/2907/6/1

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Kobayashi, T., Kariya, Y., Sasaki, T., Tanaka, M., & Tatsumi, K. (2007). Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 684-688). [4249956] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373870