Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science