Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticle

74 Citations (Scopus)

Abstract

The mechanical shear fatigue test has been performed to study the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x = 1, 2, 3, and 4) for flip-chip interconnections. The strength of the solder alloy increases with increasing silver content, preventing shear plastic deformation of the solder bump. The flip-chip joints made using higher silver content solder, such as 3%Ag and 4%Ag, exhibit longer fatigue life for all conditions. The fatigue ductility of the solder decreases with an increase in the silver content. The fatigue endurance of 1%Ag solder is superior to other solders over the plastic strain range of 3%, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder may exhibit good fatigue performance for all conditions, and the 1Ag solder is optimum for severe strain conditions.

Original languageEnglish
Pages (from-to)321-328
Number of pages8
JournalJournal of Electronic Materials
Volume33
Issue number4
DOIs
Publication statusPublished - 2004 Apr

Keywords

  • BGA joints
  • Fatigue life
  • Flip chip
  • Lead-free solder
  • Life prediction
  • Silver content
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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