Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticle

71 Citations (Scopus)

Abstract

The mechanical shear fatigue test has been performed to study the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x = 1, 2, 3, and 4) for flip-chip interconnections. The strength of the solder alloy increases with increasing silver content, preventing shear plastic deformation of the solder bump. The flip-chip joints made using higher silver content solder, such as 3%Ag and 4%Ag, exhibit longer fatigue life for all conditions. The fatigue ductility of the solder decreases with an increase in the silver content. The fatigue endurance of 1%Ag solder is superior to other solders over the plastic strain range of 3%, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder may exhibit good fatigue performance for all conditions, and the 1Ag solder is optimum for severe strain conditions.

Original languageEnglish
Pages (from-to)321-328
Number of pages8
JournalJournal of Electronic Materials
Volume33
Issue number4
Publication statusPublished - 2004 Apr
Externally publishedYes

Fingerprint

solders
Silver
Soldering alloys
shear stress
chips
silver
Fatigue of materials
Plastic deformation
fatigue tests
endurance
fatigue life
ductility
Shear deformation
plastic deformation
Ductility
Durability
plastics
shear

Keywords

  • BGA joints
  • Fatigue life
  • Flip chip
  • Lead-free solder
  • Life prediction
  • Silver content
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects. / Kariya, Yoshiharu; Hosoi, Takuya; Terashima, Shinichi; Tanaka, Masamoto; Otsuka, Masahisa.

In: Journal of Electronic Materials, Vol. 33, No. 4, 04.2004, p. 321-328.

Research output: Contribution to journalArticle

Kariya, Y, Hosoi, T, Terashima, S, Tanaka, M & Otsuka, M 2004, 'Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects', Journal of Electronic Materials, vol. 33, no. 4, pp. 321-328.
Kariya, Yoshiharu ; Hosoi, Takuya ; Terashima, Shinichi ; Tanaka, Masamoto ; Otsuka, Masahisa. / Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects. In: Journal of Electronic Materials. 2004 ; Vol. 33, No. 4. pp. 321-328.
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