Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahsia Otsuka

Research output: Contribution to journalArticle

74 Citations (Scopus)
Original languageEnglish
Pages (from-to)321-328
JournalJournal of Electronic Materials
Volume33
Publication statusPublished - 2004 Apr 1

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