Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahsia Otsuka

Research output: Contribution to journalArticle

72 Citations (Scopus)
Original languageEnglish
Pages (from-to)321-328
JournalJournal of Electronic Materials
Volume33
Publication statusPublished - 2004 Apr 1

Cite this

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects. / Kariya, Yoshiharu; Hosoi, Takuya; Terashima, Shinichi; Tanaka, Masamoto; Otsuka, Masahsia.

In: Journal of Electronic Materials, Vol. 33, 01.04.2004, p. 321-328.

Research output: Contribution to journalArticle

Kariya, Yoshiharu ; Hosoi, Takuya ; Terashima, Shinichi ; Tanaka, Masamoto ; Otsuka, Masahsia. / Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects. In: Journal of Electronic Materials. 2004 ; Vol. 33. pp. 321-328.
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