Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticle

74 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds