Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1527-1533
Journal	Journal of Electronic Materials
Volume	32
Publication status	Published - 2003 Dec 1

Cite this

@article{49daca5c259f49408207d80b9b57cd5e,

title = "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects",

author = "Shinichi Terashima and Yoshiharu Kariya and Takuya Hosoi and Masamoto Tanaka",

year = "2003",

month = dec,

day = "1",

language = "English",

volume = "32",

pages = "1527--1533",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

}