Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka

Research output: Contribution to journalArticle

150 Citations (Scopus)
Original languageEnglish
Pages (from-to)1527-1533
JournalJournal of Electronic Materials
Volume32
Publication statusPublished - 2003 Dec 1

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