Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka

Research output: Contribution to journalArticle

143 Citations (Scopus)
Original languageEnglish
Pages (from-to)1527-1533
JournalJournal of Electronic Materials
Volume32
Publication statusPublished - 2003 Dec 1

Cite this

Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. / Terashima, Shinichi; Kariya, Yoshiharu; Hosoi, Takuya; Tanaka, Masamoto.

In: Journal of Electronic Materials, Vol. 32, 01.12.2003, p. 1527-1533.

Research output: Contribution to journalArticle

Terashima, Shinichi ; Kariya, Yoshiharu ; Hosoi, Takuya ; Tanaka, Masamoto. / Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. In: Journal of Electronic Materials. 2003 ; Vol. 32. pp. 1527-1533.
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