Fingerprint Dive into the research topics of 'Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects'. Together they form a unique fingerprint.
- Sort by
- Weight
- Alphabetically
Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects
Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka
Research output: Contribution to journal › Article › peer-review
153
Citations
(Scopus)