Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects

Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka

Research output: Contribution to journalArticlepeer-review

153 Citations (Scopus)

Fingerprint Dive into the research topics of 'Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds