Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy

Yoshiharu Kariya, Yasuo Oguchi, Hiromi Kawamata, Massahisa Otsuka

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	1673-1678
Journal	Proc. of Fifth Japan International SAMPE Symposium
Volume	5
Publication status	Published - 1997 Oct 1

Cite this

@article{aad8b3a4e9094bd7aee5d957613ef552,

title = "Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy",

author = "Yoshiharu Kariya and Yasuo Oguchi and Hiromi Kawamata and Massahisa Otsuka",

year = "1997",

month = oct,

day = "1",

language = "English",

volume = "5",

pages = "1673--1678",

journal = "Proc. of Fifth Japan International SAMPE Symposium",

}

TY - JOUR

T1 - Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy

AU - Kariya, Yoshiharu

AU - Oguchi, Yasuo

AU - Kawamata, Hiromi

AU - Otsuka, Massahisa

PY - 1997/10/1

Y1 - 1997/10/1

M3 - Article

VL - 5

SP - 1673

EP - 1678

JO - Proc. of Fifth Japan International SAMPE Symposium

JF - Proc. of Fifth Japan International SAMPE Symposium

ER -