| Original language | English |
|---|---|
| Pages (from-to) | 1673-1678 |
| Journal | Proc. of Fifth Japan International SAMPE Symposium |
| Volume | 5 |
| Publication status | Published - 1997 Oct 1 |
Cite this
Kariya, Y., Oguchi, Y., Kawamata, H., & Otsuka, M. (1997). Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy. Proc. of Fifth Japan International SAMPE Symposium, 5, 1673-1678.
Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy. / Kariya, Yoshiharu; Oguchi, Yasuo; Kawamata, Hiromi; Otsuka, Massahisa.
In: Proc. of Fifth Japan International SAMPE Symposium, Vol. 5, 01.10.1997, p. 1673-1678.Research output: Contribution to journal › Article
Kariya, Y, Oguchi, Y, Kawamata, H & Otsuka, M 1997, 'Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy', Proc. of Fifth Japan International SAMPE Symposium, vol. 5, pp. 1673-1678.
Kariya Y, Oguchi Y, Kawamata H, Otsuka M. Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy. Proc. of Fifth Japan International SAMPE Symposium. 1997 Oct 1;5:1673-1678.
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title = "Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass{\%}Ag Solder Alloy",
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AU - Kariya, Yoshiharu
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AU - Kawamata, Hiromi
AU - Otsuka, Massahisa
PY - 1997/10/1
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JO - Proc. of Fifth Japan International SAMPE Symposium
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