Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

Yoshihiko Kanda, Yoshiharu Kariya, Takeshi Tasaka

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The effects of temperature and strain-enhanced coarsening of intermetallic compounds (IMCs) on the cyclic strain-hardening exponent of Sn-Ag-Cu microsolder joints were investigated. The effect of temperature on the exponent is described by the Arrhenius function, and the cyclic strain-hardening exponent is proportional to the reciprocal square root of the average radius of the IMCs. Ag3Sn and Cu6Sn5 IMCs coarsened with time, temperature, and inelastic strain. In the growth process with time and temperature, the phase-size exponent and activation energy for a Sn-Ag-Cu microsolder joint were ~3 and 50 kJ/mol, respectively. Ag3Sn and Cu6Sn5 growth with isothermal aging was controlled by the diffusion of Ag and Cu in the Sn matrix. In addition, the strain-enhanced coarsening of the IMCs can be described by the growth model with consideration of isothermal aging and inelastic strain-enhanced growth. Therefore, the cyclic strain-hardening exponent decreases with temperature, and the strain-enhanced coarsening of IMCs can be described by the reciprocal square root of the average radius of the IMCs and the strain-enhanced growth model.

Original languageEnglish
Pages (from-to)2072-2077
Number of pages6
JournalMaterials Transactions
Volume53
Issue number12
DOIs
Publication statusPublished - 2012

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strain hardening
Coarsening
Strain hardening
Intermetallics
intermetallics
exponents
Temperature
Aging of materials
temperature
radii
Activation energy
activation energy
matrices

Keywords

  • Coffin-Manson's law
  • Cyclic strain-hardening exponent
  • Fatigue ductility exponent
  • Intermetallic compounds
  • Isothermal aging
  • Microstructural coarsening
  • Miniature test
  • Strain-enhanced growth
  • Tinsilvercopper

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints. / Kanda, Yoshihiko; Kariya, Yoshiharu; Tasaka, Takeshi.

In: Materials Transactions, Vol. 53, No. 12, 2012, p. 2072-2077.

Research output: Contribution to journalArticle

@article{7ee8d908507243c4b76b3c5f57d452cf,
title = "Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints",
abstract = "The effects of temperature and strain-enhanced coarsening of intermetallic compounds (IMCs) on the cyclic strain-hardening exponent of Sn-Ag-Cu microsolder joints were investigated. The effect of temperature on the exponent is described by the Arrhenius function, and the cyclic strain-hardening exponent is proportional to the reciprocal square root of the average radius of the IMCs. Ag3Sn and Cu6Sn5 IMCs coarsened with time, temperature, and inelastic strain. In the growth process with time and temperature, the phase-size exponent and activation energy for a Sn-Ag-Cu microsolder joint were ~3 and 50 kJ/mol, respectively. Ag3Sn and Cu6Sn5 growth with isothermal aging was controlled by the diffusion of Ag and Cu in the Sn matrix. In addition, the strain-enhanced coarsening of the IMCs can be described by the growth model with consideration of isothermal aging and inelastic strain-enhanced growth. Therefore, the cyclic strain-hardening exponent decreases with temperature, and the strain-enhanced coarsening of IMCs can be described by the reciprocal square root of the average radius of the IMCs and the strain-enhanced growth model.",
keywords = "Coffin-Manson's law, Cyclic strain-hardening exponent, Fatigue ductility exponent, Intermetallic compounds, Isothermal aging, Microstructural coarsening, Miniature test, Strain-enhanced growth, Tinsilvercopper",
author = "Yoshihiko Kanda and Yoshiharu Kariya and Takeshi Tasaka",
year = "2012",
doi = "10.2320/matertrans.MB201205",
language = "English",
volume = "53",
pages = "2072--2077",
journal = "Materials Transactions",
issn = "1345-9678",
publisher = "Japan Institute of Metals (JIM)",
number = "12",

}

TY - JOUR

T1 - Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

AU - Kanda, Yoshihiko

AU - Kariya, Yoshiharu

AU - Tasaka, Takeshi

PY - 2012

Y1 - 2012

N2 - The effects of temperature and strain-enhanced coarsening of intermetallic compounds (IMCs) on the cyclic strain-hardening exponent of Sn-Ag-Cu microsolder joints were investigated. The effect of temperature on the exponent is described by the Arrhenius function, and the cyclic strain-hardening exponent is proportional to the reciprocal square root of the average radius of the IMCs. Ag3Sn and Cu6Sn5 IMCs coarsened with time, temperature, and inelastic strain. In the growth process with time and temperature, the phase-size exponent and activation energy for a Sn-Ag-Cu microsolder joint were ~3 and 50 kJ/mol, respectively. Ag3Sn and Cu6Sn5 growth with isothermal aging was controlled by the diffusion of Ag and Cu in the Sn matrix. In addition, the strain-enhanced coarsening of the IMCs can be described by the growth model with consideration of isothermal aging and inelastic strain-enhanced growth. Therefore, the cyclic strain-hardening exponent decreases with temperature, and the strain-enhanced coarsening of IMCs can be described by the reciprocal square root of the average radius of the IMCs and the strain-enhanced growth model.

AB - The effects of temperature and strain-enhanced coarsening of intermetallic compounds (IMCs) on the cyclic strain-hardening exponent of Sn-Ag-Cu microsolder joints were investigated. The effect of temperature on the exponent is described by the Arrhenius function, and the cyclic strain-hardening exponent is proportional to the reciprocal square root of the average radius of the IMCs. Ag3Sn and Cu6Sn5 IMCs coarsened with time, temperature, and inelastic strain. In the growth process with time and temperature, the phase-size exponent and activation energy for a Sn-Ag-Cu microsolder joint were ~3 and 50 kJ/mol, respectively. Ag3Sn and Cu6Sn5 growth with isothermal aging was controlled by the diffusion of Ag and Cu in the Sn matrix. In addition, the strain-enhanced coarsening of the IMCs can be described by the growth model with consideration of isothermal aging and inelastic strain-enhanced growth. Therefore, the cyclic strain-hardening exponent decreases with temperature, and the strain-enhanced coarsening of IMCs can be described by the reciprocal square root of the average radius of the IMCs and the strain-enhanced growth model.

KW - Coffin-Manson's law

KW - Cyclic strain-hardening exponent

KW - Fatigue ductility exponent

KW - Intermetallic compounds

KW - Isothermal aging

KW - Microstructural coarsening

KW - Miniature test

KW - Strain-enhanced growth

KW - Tinsilvercopper

UR - http://www.scopus.com/inward/record.url?scp=84870655108&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84870655108&partnerID=8YFLogxK

U2 - 10.2320/matertrans.MB201205

DO - 10.2320/matertrans.MB201205

M3 - Article

AN - SCOPUS:84870655108

VL - 53

SP - 2072

EP - 2077

JO - Materials Transactions

JF - Materials Transactions

SN - 1345-9678

IS - 12

ER -