Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka

Research output: Contribution to journalArticle

58 Citations (Scopus)
Original languageEnglish
JournalDefault journal
Publication statusPublished - 1999 Mar 1

Cite this