Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka

Research output: Contribution to journalArticle

57 Citations (Scopus)
Original languageEnglish
JournalDefault journal
Publication statusPublished - 1999 Mar 1

Cite this

Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints. / Kariya, Yoshiharu; Hirata, Yasunori; Otsuka, Masahisa.

In: Default journal, 01.03.1999.

Research output: Contribution to journalArticle

@article{9653217bbf524e349704a41c0eda332a,
title = "Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints",
author = "Yoshiharu Kariya and Yasunori Hirata and Masahisa Otsuka",
year = "1999",
month = "3",
day = "1",
language = "English",
journal = "Default journal",

}

TY - JOUR

T1 - Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

AU - Kariya, Yoshiharu

AU - Hirata, Yasunori

AU - Otsuka, Masahisa

PY - 1999/3/1

Y1 - 1999/3/1

M3 - Article

JO - Default journal

JF - Default journal

ER -