Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

Y. K, a a, K. Zama, Y. Kariya, T. Mikami, T. Kobayashi, T. Enomoto, K. Hirata

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)755-759
JournalASME-InterPACK
Publication statusPublished - 2009 Jul 1

Cite this

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T., & Hirata, K. (2009). Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package. ASME-InterPACK, 755-759.