Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

Y. K, a a, K. Zama, Y. Kariya, T. Mikami, T. Kobayashi, T. Enomoto, K. Hirata

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)755-759
JournalASME-InterPACK
Publication statusPublished - 2009 Jul 1

Cite this

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., ... Hirata, K. (2009). Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package. ASME-InterPACK, 755-759.

Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package. / K, Y.; a, a; Zama, K.; Kariya, Y.; Mikami, T.; Kobayashi, T.; Enomoto, T.; Hirata, K.

In: ASME-InterPACK, 01.07.2009, p. 755-759.

Research output: Contribution to journalArticle

K, Y, a, A, Zama, K, Kariya, Y, Mikami, T, Kobayashi, T, Enomoto, T & Hirata, K 2009, 'Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package', ASME-InterPACK, pp. 755-759.
K Y, a A, Zama K, Kariya Y, Mikami T, Kobayashi T et al. Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package. ASME-InterPACK. 2009 Jul 1;755-759.
K, Y. ; a, a ; Zama, K. ; Kariya, Y. ; Mikami, T. ; Kobayashi, T. ; Enomoto, T. ; Hirata, K. / Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package. In: ASME-InterPACK. 2009 ; pp. 755-759.
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