Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps

S. Honma, K. Tateyama, H. Yamada, K. Doi, N. Hirano, T. Okada, H. Aoki, Y. Hiruta, T. Sudo

Research output: Contribution to journalArticle

Abstract

This paper describes effective thin-film structure barrier metals for use as eutectic solder bumps. Shear strength and bump interconnection resistance were evaluated. The mutual diffusion in metals was investigated. Barrier metal structures -Cu/Ti, Ni/Ti and Cu/Cr - were evaluated after ageing. The Ni/Ti structure has good reliability according to ageing test results. Pd is used for improvement of solder wettability and as an oxidisation barrier. Consequently, it was concluded that a thin-film Pd/Ni/ Ti barrier metal is suitable for use as eutectic solder bumps. The broken interfaces of the solder bumps were analysed by scanning auger electron spectrometry. In the thin-film Cu/Ti structure, decrease in the shear strength is caused by three mechanisms, as determined from the broken interface analysis. The three mechanisms are mixed metal formation, Ti oxidisation and diffusion between barrier metals and Al. Furthermore, TCT and PCT were carried out on these eutectic solder bumps to confirm the interconnection reliability. The TCT and PCT results prove that electrical connection is stable.

Original languageEnglish
Pages (from-to)47-50
Number of pages4
JournalMicroelectronics International
Volume14
Issue number3
Publication statusPublished - 1997 Sep

Fingerprint

solders
eutectics
Soldering alloys
Eutectics
Metals
Thin films
thin films
metals
shear strength
Shear strength
Aging of materials
Diffusion barriers
wettability
Spectrometry
Wetting
Scanning
scanning
titanium nickelide
Electrons
spectroscopy

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Honma, S., Tateyama, K., Yamada, H., Doi, K., Hirano, N., Okada, T., ... Sudo, T. (1997). Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps. Microelectronics International, 14(3), 47-50.

Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps. / Honma, S.; Tateyama, K.; Yamada, H.; Doi, K.; Hirano, N.; Okada, T.; Aoki, H.; Hiruta, Y.; Sudo, T.

In: Microelectronics International, Vol. 14, No. 3, 09.1997, p. 47-50.

Research output: Contribution to journalArticle

Honma, S, Tateyama, K, Yamada, H, Doi, K, Hirano, N, Okada, T, Aoki, H, Hiruta, Y & Sudo, T 1997, 'Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps', Microelectronics International, vol. 14, no. 3, pp. 47-50.
Honma S, Tateyama K, Yamada H, Doi K, Hirano N, Okada T et al. Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps. Microelectronics International. 1997 Sep;14(3):47-50.
Honma, S. ; Tateyama, K. ; Yamada, H. ; Doi, K. ; Hirano, N. ; Okada, T. ; Aoki, H. ; Hiruta, Y. ; Sudo, T. / Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps. In: Microelectronics International. 1997 ; Vol. 14, No. 3. pp. 47-50.
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