Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)87-92
JournalISHM ’96
Publication statusPublished - 1996 Oct 25

Cite this

S.Honma, S. H., K.Tateyama, K. T., H.Yamada, H. Y., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., C.Takubo, C. T., T.Sudo, T. S., & Sudo, T. (1996). Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96, 87-92.