Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)87-92
JournalISHM ’96
Publication statusPublished - 1996 Oct 25

Cite this