Original language | English |
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Pages (from-to) | 87-92 |
Journal | ISHM ’96 |
Publication status | Published - 1996 Oct 25 |
Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,
S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo
Research output: Contribution to journal › Article › peer-review