Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)87-92
JournalISHM ’96
Publication statusPublished - 1996 Oct 25

Cite this

S.Honma, S. H., K.Tateyama, K. T., H.Yamada, H. Y., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., ... Sudo, T. (1996). Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96, 87-92.

Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, / S.Honma, S.Honma; K.Tateyama, K.Tateyama; H.Yamada, H.Yamada; K.Doi, K.Doi; N.Hirano, N.Hirano; T.Okada, T.Okada; C.Takubo, C.Takubo; T.Sudo, T.Sudo; Sudo, Toshio.

In: ISHM ’96, 25.10.1996, p. 87-92.

Research output: Contribution to journalArticle

S.Honma, SH, K.Tateyama, KT, H.Yamada, HY, K.Doi, KD, N.Hirano, NH, T.Okada, TO, C.Takubo, CT, T.Sudo, TS & Sudo, T 1996, 'Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,', ISHM ’96, pp. 87-92.
S.Honma SH, K.Tateyama KT, H.Yamada HY, K.Doi KD, N.Hirano NH, T.Okada TO et al. Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96. 1996 Oct 25;87-92.
S.Honma, S.Honma ; K.Tateyama, K.Tateyama ; H.Yamada, H.Yamada ; K.Doi, K.Doi ; N.Hirano, N.Hirano ; T.Okada, T.Okada ; C.Takubo, C.Takubo ; T.Sudo, T.Sudo ; Sudo, Toshio. / Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,. In: ISHM ’96. 1996 ; pp. 87-92.
@article{d9ef65a186ca4089bd00612133593ce9,
title = "Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,",
author = "S.Honma S.Honma and K.Tateyama K.Tateyama and H.Yamada H.Yamada and K.Doi K.Doi and N.Hirano N.Hirano and T.Okada T.Okada and C.Takubo C.Takubo and T.Sudo T.Sudo and Toshio Sudo",
year = "1996",
month = "10",
day = "25",
language = "English",
pages = "87--92",
journal = "ISHM ’96",

}

TY - JOUR

T1 - Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

AU - S.Honma, S.Honma

AU - K.Tateyama, K.Tateyama

AU - H.Yamada, H.Yamada

AU - K.Doi, K.Doi

AU - N.Hirano, N.Hirano

AU - T.Okada, T.Okada

AU - C.Takubo, C.Takubo

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1996/10/25

Y1 - 1996/10/25

M3 - Article

SP - 87

EP - 92

JO - ISHM ’96

JF - ISHM ’96

ER -