Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma; K.Tateyama K.Tateyama; H.Yamada H.Yamada; K.Doi K.Doi; N.Hirano N.Hirano; T.Okada T.Okada; C.Takubo C.Takubo; T.Sudo T.Sudo; Toshio Sudo

Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo

Functional Control Systems

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	87-92
Journal	ISHM ’96
Publication status	Published - 1996 Oct 25

Cite this

S.Honma, S. H., K.Tateyama, K. T., H.Yamada, H. Y., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., ... Sudo, T. (1996). Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96, 87-92.

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title = "Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,",

author = "S.Honma S.Honma and K.Tateyama K.Tateyama and H.Yamada H.Yamada and K.Doi K.Doi and N.Hirano N.Hirano and T.Okada T.Okada and C.Takubo C.Takubo and T.Sudo T.Sudo and Toshio Sudo",

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AU - S.Honma, S.Honma

AU - K.Tateyama, K.Tateyama

AU - H.Yamada, H.Yamada

AU - K.Doi, K.Doi

AU - N.Hirano, N.Hirano

AU - T.Okada, T.Okada

AU - C.Takubo, C.Takubo

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1996/10/25

Y1 - 1996/10/25

M3 - Article

SP - 87

EP - 92

JO - ISHM ’96

JF - ISHM ’96

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