Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)87-92
JournalISHM ’96
Publication statusPublished - 1996 Oct 25

Cite this

S.Honma, S. H., K.Tateyama, K. T., H.Yamada, H. Y., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., ... Sudo, T. (1996). Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96, 87-92.