| Original language | English |
|---|---|
| Pages (from-to) | 87-92 |
| Journal | ISHM ’96 |
| Publication status | Published - 1996 Oct 25 |
Cite this
S.Honma, S. H., K.Tateyama, K. T., H.Yamada, H. Y., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., ... Sudo, T. (1996). Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96, 87-92.
Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, / S.Honma, S.Honma; K.Tateyama, K.Tateyama; H.Yamada, H.Yamada; K.Doi, K.Doi; N.Hirano, N.Hirano; T.Okada, T.Okada; C.Takubo, C.Takubo; T.Sudo, T.Sudo; Sudo, Toshio.
In: ISHM ’96, 25.10.1996, p. 87-92.Research output: Contribution to journal › Article
S.Honma, SH, K.Tateyama, KT, H.Yamada, HY, K.Doi, KD, N.Hirano, NH, T.Okada, TO, C.Takubo, CT, T.Sudo, TS & Sudo, T 1996, 'Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,', ISHM ’96, pp. 87-92.
S.Honma SH, K.Tateyama KT, H.Yamada HY, K.Doi KD, N.Hirano NH, T.Okada TO et al. Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps, ISHM ’96. 1996 Oct 25;87-92.
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title = "Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,",
author = "S.Honma S.Honma and K.Tateyama K.Tateyama and H.Yamada H.Yamada and K.Doi K.Doi and N.Hirano N.Hirano and T.Okada T.Okada and C.Takubo C.Takubo and T.Sudo T.Sudo and Toshio Sudo",
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AU - K.Tateyama, K.Tateyama
AU - H.Yamada, H.Yamada
AU - K.Doi, K.Doi
AU - N.Hirano, N.Hirano
AU - T.Okada, T.Okada
AU - C.Takubo, C.Takubo
AU - T.Sudo, T.Sudo
AU - Sudo, Toshio
PY - 1996/10/25
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JO - ISHM ’96
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