Effects of binder addition on the mechanical properties of bulk Y-Ba-Cu-O superconductors

H. Seki, A. Wongsatanawarid, S. Kobayashi, Y. Ikeda, M. Murakami

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

We studied the effects of binder addition on the mechanical properties of bulk Y-Ba-Cu-O superconductors. We prepared YBa2Cu3O y, Y2BaCuO5 powders and polyvinyl alcohol mixed with water as a binder. These raw materials were mixed, and the binder-added powders were pressed into pellets. The hardness of the green compacts with binder is higher than that without the binder. However, the hardness of green compacts with 8% binder is the same as that with 4% binder. The maximum compression strength of the precursor with binder is higher than that without binder. Equally, the maximum strength of the green compacts with 8% binder is higher than that with 4% binder. The differential thermal analysis measurements showed that the exothermic reaction due to the decomposition of the organic binder started at 550 °C and gradually proceeded with further heating. After de-binder treatment, BaCO3 powders were produced on the green compacts. The green compacts were subjected to melt-processing. We also measured trapped magnetic fields of binder-added bulk Y-Ba-Cu-O superconductors with a Hall probe scanning device. Trapped magnetic field of the bulk added with 4% is higher than that of the binder-free bulk. Hence, Y-Ba-Cu-O bulk with suitable amount of binder shows good influence for mechanical strength and trapped magnetic field.

Original languageEnglish
Pages (from-to)1177-1180
Number of pages4
JournalPhysica C: Superconductivity and its applications
Volume470
Issue number20
DOIs
Publication statusPublished - 2010 Nov 1

Keywords

  • Binder
  • Bulk
  • Hardness
  • Mechanical strength
  • Trapped magnetic field
  • Y-Ba-Cu-O

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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