Radiating mechanism and reduction measures have been studied using test LSI and PCB. Among LSI operation modes, I/O buffer operation radiates the greatest amount of emission and shows that LSI mounting area behaves an opening from the electromagnetic viewpoint. The measure, decreasing extent of electromagnetic field at LSI mounting area, have been verified effective.
|Number of pages||4|
|Publication status||Published - 2001 Dec 1|
|Event||IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States|
Duration: 2001 Oct 29 → 2001 Oct 31
|Conference||IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging|
|Period||01/10/29 → 01/10/31|
ASJC Scopus subject areas