Electrical characterization and modeling of simultaneous switching noise for leadframe packages

Masayuki Miura, Naohiko Hirano, Yoichi Hiruta, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Quad flat packages with a leadframe made of copper, or alloy 42 are widely used for CMOS digital applications. To investigate the relationship between package inductance and switching noise, three types of leadframe materials, Cu, alloy 42, and Ag-plated alloy 42 were tested for frequency-dependent properties. Experiments were executed by using a CMOS noise generating chip to measure how leadframe materials influence switching noise in conjunction with output buffer characteristics. Alloy 42 showed high permeability of ferromagnetics, making it unsuitable for high-speed CMOS applications. Measured values of inductance and resistance corresponding to the frequency of the edge rate were used in modeling the leadframe packages.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages857-864
Number of pages8
Publication statusPublished - 1995
EventProceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA
Duration: 1995 May 211995 May 24

Other

OtherProceedings of the 1995 45th Electronic Components & Technology Conference
CityLas Vegas, NV, USA
Period95/5/2195/5/24

Fingerprint

Inductance
Copper alloys
Copper
Experiments

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Miura, M., Hirano, N., Hiruta, Y., & Sudo, T. (1995). Electrical characterization and modeling of simultaneous switching noise for leadframe packages. In Proceedings - Electronic Components and Technology Conference (pp. 857-864). IEEE.

Electrical characterization and modeling of simultaneous switching noise for leadframe packages. / Miura, Masayuki; Hirano, Naohiko; Hiruta, Yoichi; Sudo, Toshio.

Proceedings - Electronic Components and Technology Conference. IEEE, 1995. p. 857-864.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miura, M, Hirano, N, Hiruta, Y & Sudo, T 1995, Electrical characterization and modeling of simultaneous switching noise for leadframe packages. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 857-864, Proceedings of the 1995 45th Electronic Components & Technology Conference, Las Vegas, NV, USA, 95/5/21.
Miura M, Hirano N, Hiruta Y, Sudo T. Electrical characterization and modeling of simultaneous switching noise for leadframe packages. In Proceedings - Electronic Components and Technology Conference. IEEE. 1995. p. 857-864
Miura, Masayuki ; Hirano, Naohiko ; Hiruta, Yoichi ; Sudo, Toshio. / Electrical characterization and modeling of simultaneous switching noise for leadframe packages. Proceedings - Electronic Components and Technology Conference. IEEE, 1995. pp. 857-864
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