Electrical design and characterization of Si interposer for system-in-package (SiP)

Shinobu Kato, Tomoyuki Tango, Kiyohisa Hasegawa, Ramesh K. Bhandari, Atsushi Sakai, Hiroshi Segawa, Takashi Kariya, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Si interposer technology has the potential to enable highbandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (≤5um) wiring can be fabricated. However, the ultrafine pitch wiring may adversely affect the electrical performance of devices. This paper discusses the signal propagation properties of ultra-fine coplanar interconnects on Si interposers. A design chart of the interconnects, obtained from the viewpoint of maximum line length versus target operating frequency, is presented.

Original languageEnglish
Title of host publication2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages1648-1653
Number of pages6
DOIs
Publication statusPublished - 2009 Oct 12
Event2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
Duration: 2009 May 262009 May 29

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2009 59th Electronic Components and Technology Conference, ECTC 2009
CountryUnited States
CitySan Diego, CA
Period09/5/2609/5/29

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Kato, S., Tango, T., Hasegawa, K., Bhandari, R. K., Sakai, A., Segawa, H., Kariya, T., & Sudo, T. (2009). Electrical design and characterization of Si interposer for system-in-package (SiP). In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 1648-1653). [5074236] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074236