Electrical design and characterization of Si interposer for system-in-package (SiP)

Shinobu Kato, Tomoyuki Tango, Kiyohisa Hasegawa, Ramesh K. Bhandari, Atsushi Sakai, Hiroshi Segawa, Takashi Kariya, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science