Electrical properties of a multilayer thin film substrate for multichip packages

Osamu Shimada, Kenji Ito, Takeshi Miyagi, Susumu Kimijima, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

The authors report the electrical properties of multilayer thin-film interconnects examined under circumstances in which the signal lines were sandwiched between mesh-pattern metal layers (called meshed striplines). Multilayer thin-film substrates with various transmission line structures were manufactured with several mesh patterns (power/ground planes) and signal lines, and the characteristic impedance and crosstalk for these lines were measured. The relations between the electrical properties and the meshed-stripline structures were obtained from the measurements for use in designing multilayer thin-film interconnects. It is shown that, in meshed-stripline structures, the characteristic impedance can be controlled by changing the aperture ratio or the mesh pitch. The fluctuation in the characteristic impedance along the signal-propagation direction was insignificant. It was also found that the crosstalk noise in meshed-stripline structures can be made as low as those in ordinary stripline structures.

Original languageEnglish
Title of host publicationSixth IEEE CHMT Int Electron Manuf Technol Symp
Editors Anon
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages121-127
Number of pages7
Publication statusPublished - 1989
EventSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan
Duration: 1989 Apr 261989 Apr 28

Other

OtherSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium
CityNara, Japan
Period89/4/2689/4/28

Fingerprint

Multilayer films
Electric properties
Crosstalk
Thin films
Substrates
Strip telecommunication lines
Electric lines
Metals

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Shimada, O., Ito, K., Miyagi, T., Kimijima, S., & Sudo, T. (1989). Electrical properties of a multilayer thin film substrate for multichip packages. In Anon (Ed.), Sixth IEEE CHMT Int Electron Manuf Technol Symp (pp. 121-127). Piscataway, NJ, United States: Publ by IEEE.

Electrical properties of a multilayer thin film substrate for multichip packages. / Shimada, Osamu; Ito, Kenji; Miyagi, Takeshi; Kimijima, Susumu; Sudo, Toshio.

Sixth IEEE CHMT Int Electron Manuf Technol Symp. ed. / Anon. Piscataway, NJ, United States : Publ by IEEE, 1989. p. 121-127.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shimada, O, Ito, K, Miyagi, T, Kimijima, S & Sudo, T 1989, Electrical properties of a multilayer thin film substrate for multichip packages. in Anon (ed.), Sixth IEEE CHMT Int Electron Manuf Technol Symp. Publ by IEEE, Piscataway, NJ, United States, pp. 121-127, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Nara, Japan, 89/4/26.
Shimada O, Ito K, Miyagi T, Kimijima S, Sudo T. Electrical properties of a multilayer thin film substrate for multichip packages. In Anon, editor, Sixth IEEE CHMT Int Electron Manuf Technol Symp. Piscataway, NJ, United States: Publ by IEEE. 1989. p. 121-127
Shimada, Osamu ; Ito, Kenji ; Miyagi, Takeshi ; Kimijima, Susumu ; Sudo, Toshio. / Electrical properties of a multilayer thin film substrate for multichip packages. Sixth IEEE CHMT Int Electron Manuf Technol Symp. editor / Anon. Piscataway, NJ, United States : Publ by IEEE, 1989. pp. 121-127
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