Electrical properties of a multilayer thin film substrate for multichip packages

Osamu Shimada, Kenji Ito, Takeshi Miyagi, Susumu Kimijima, Toshio Sudo

Research output: Contribution to conferencePaper

Abstract

The authors report the electrical properties of multilayer thin-film interconnects examined under circumstances in which the signal lines were sandwiched between mesh-pattern metal layers (called meshed striplines). Multilayer thin-film substrates with various transmission line structures were manufactured with several mesh patterns (power/ground planes) and signal lines, and the characteristic impedance and crosstalk for these lines were measured. The relations between the electrical properties and the meshed-stripline structures were obtained from the measurements for use in designing multilayer thin-film interconnects. It is shown that, in meshed-stripline structures, the characteristic impedance can be controlled by changing the aperture ratio or the mesh pitch. The fluctuation in the characteristic impedance along the signal-propagation direction was insignificant. It was also found that the crosstalk noise in meshed-stripline structures can be made as low as those in ordinary stripline structures.

Original languageEnglish
Pages121-127
Number of pages7
Publication statusPublished - 1989 Dec 1
EventSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan
Duration: 1989 Apr 261989 Apr 28

Other

OtherSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium
CityNara, Japan
Period89/4/2689/4/28

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Shimada, O., Ito, K., Miyagi, T., Kimijima, S., & Sudo, T. (1989). Electrical properties of a multilayer thin film substrate for multichip packages. 121-127. Paper presented at Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Nara, Japan, .