Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages,

O.Shimada O.Shimada, K.Ito K.Ito, T.Miyagi T.Miyagi, S.Kimijima S.Kimijima, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journal › Article › peer-review

Cite this

@article{776804d003e9473f9a2bf43fb746adfd,

title = "Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages,",

author = "O.Shimada O.Shimada and K.Ito K.Ito and T.Miyagi T.Miyagi and S.Kimijima S.Kimijima and T.Sudo T.Sudo and Toshio Sudo",

year = "1989",

month = may,

day = "25",

language = "English",

pages = "123--129",

journal = "IEMT Japan Symposium",

}