Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages,

O.Shimada O.Shimada, K.Ito K.Ito, T.Miyagi T.Miyagi, S.Kimijima S.Kimijima, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

9 Citations (Scopus)
Original languageEnglish
Pages (from-to)123-129
JournalIEMT Japan Symposium
Publication statusPublished - 1989 May 25

Cite this

O.Shimada, O. S., K.Ito, K. I., T.Miyagi, T. M., S.Kimijima, S. K., T.Sudo, T. S., & Sudo, T. (1989). Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages, IEMT Japan Symposium, 123-129.

Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages, / O.Shimada, O.Shimada; K.Ito, K.Ito; T.Miyagi, T.Miyagi; S.Kimijima, S.Kimijima; T.Sudo, T.Sudo; Sudo, Toshio.

In: IEMT Japan Symposium, 25.05.1989, p. 123-129.

Research output: Contribution to journalArticle

O.Shimada, OS, K.Ito, KI, T.Miyagi, TM, S.Kimijima, SK, T.Sudo, TS & Sudo, T 1989, 'Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages,', IEMT Japan Symposium, pp. 123-129.
O.Shimada OS, K.Ito KI, T.Miyagi TM, S.Kimijima SK, T.Sudo TS, Sudo T. Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages, IEMT Japan Symposium. 1989 May 25;123-129.
O.Shimada, O.Shimada ; K.Ito, K.Ito ; T.Miyagi, T.Miyagi ; S.Kimijima, S.Kimijima ; T.Sudo, T.Sudo ; Sudo, Toshio. / Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages,. In: IEMT Japan Symposium. 1989 ; pp. 123-129.
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