Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages,

O.Shimada O.Shimada, K.Ito K.Ito, T.Miyagi T.Miyagi, S.Kimijima S.Kimijima, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

9 Citations (Scopus)
Original languageEnglish
Pages (from-to)123-129
JournalIEMT Japan Symposium
Publication statusPublished - 1989 May 25

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O.Shimada, O. S., K.Ito, K. I., T.Miyagi, T. M., S.Kimijima, S. K., T.Sudo, T. S., & Sudo, T. (1989). Electrical Properties of a Multilayer Thin Film Substrate for Multichip Packages, IEMT Japan Symposium, 123-129.