Electrodeposition of CuInTe2 film from an acidic solution

T. Ishizaki, N. Saito, A. Fuwa

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

Copper-indium-telluride films were electrochemically deposited from solutions containing CuCl2, InCl3, TeO2 and HCl. Although a flat and smooth film with closely stoichiometric composition was deposited at -660 mV vs. Ag/AgCl at 303 K from a solution of 2.5×10-4 mol dm-3 CuCl2, 1.0×10-2 mol dm-3 InCl3, 5.0×10-4 mol dm-3 TeO2 and 0.1 mol dm-3 HCl, a polycrystalline CuInTe2 film was not obtained. Increasing the temperature from 303 to 363 K allowed the deposition at lower overpotential of a polycrystalline CuInTe2 film with closely stoichiometric composition and increased indium content. The band gap of the polycrystalline CuInTe2 film electrodeposited at 363 K at -660 mV was 0.98 eV.

Original languageEnglish
Pages (from-to)156-160
Number of pages5
JournalSurface and Coatings Technology
Volume182
Issue number2-3
DOIs
Publication statusPublished - 2004 Apr 22

Keywords

  • Copper-indium-telluride
  • Deposition process
  • Electrochemistry

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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