Abstract
The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.
Original language | English |
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Pages (from-to) | 781-785 |
Number of pages | 5 |
Journal | Proceedings - Electronic Components and Technology Conference |
Publication status | Published - 2000 Dec 1 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering