Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Toshio Sudo; Yakushi Ko; Shingo Sakaguchi; Takeji Tokumaru

Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Toshio Sudo, Yakushi Ko, Shingo Sakaguchi, Takeji Tokumaru

Electrical Engineering and Computer Science

Research output: Contribution to journal › Conference article › peer-review

7 Citations (Scopus)

Abstract

The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

Original language	English
Pages (from-to)	781-785
Number of pages	5
Journal	Proceedings - Electronic Components and Technology Conference
Publication status	Published - 2000 Dec 1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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title = "Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging",

abstract = "The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.",

author = "Toshio Sudo and Yakushi Ko and Shingo Sakaguchi and Takeji Tokumaru",

year = "2000",

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journal = "Proceedings - Electronic Components and Technology Conference",

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T1 - Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

AU - Sudo, Toshio

AU - Ko, Yakushi

AU - Sakaguchi, Shingo

AU - Tokumaru, Takeji

PY - 2000/12/1

Y1 - 2000/12/1

N2 - The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

AB - The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

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M3 - Conference article

AN - SCOPUS:0034476174

SP - 781

EP - 785

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

SN - 0569-5503

ER -

Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Abstract

ASJC Scopus subject areas

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