Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Toshio Sudo, Yakushi Ko, Shingo Sakaguchi, Takeji Tokumaru

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages781-785
Number of pages5
Publication statusPublished - 2000

Fingerprint

Electromagnetic waves
Packaging
Networks (circuits)
SPICE
Polychlorinated biphenyls
Capacitance
Controllers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sudo, T., Ko, Y., Sakaguchi, S., & Tokumaru, T. (2000). Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging. In Proceedings - Electronic Components and Technology Conference (pp. 781-785). IEEE.

Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging. / Sudo, Toshio; Ko, Yakushi; Sakaguchi, Shingo; Tokumaru, Takeji.

Proceedings - Electronic Components and Technology Conference. IEEE, 2000. p. 781-785.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sudo, T, Ko, Y, Sakaguchi, S & Tokumaru, T 2000, Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 781-785.
Sudo T, Ko Y, Sakaguchi S, Tokumaru T. Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging. In Proceedings - Electronic Components and Technology Conference. IEEE. 2000. p. 781-785
Sudo, Toshio ; Ko, Yakushi ; Sakaguchi, Shingo ; Tokumaru, Takeji. / Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging. Proceedings - Electronic Components and Technology Conference. IEEE, 2000. pp. 781-785
@inproceedings{c5b2f9a3ab7c455397be94a31106eaee,
title = "Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging",
abstract = "The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.",
author = "Toshio Sudo and Yakushi Ko and Shingo Sakaguchi and Takeji Tokumaru",
year = "2000",
language = "English",
pages = "781--785",
booktitle = "Proceedings - Electronic Components and Technology Conference",
publisher = "IEEE",

}

TY - GEN

T1 - Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

AU - Sudo, Toshio

AU - Ko, Yakushi

AU - Sakaguchi, Shingo

AU - Tokumaru, Takeji

PY - 2000

Y1 - 2000

N2 - The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

AB - The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

UR - http://www.scopus.com/inward/record.url?scp=0034476174&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034476174&partnerID=8YFLogxK

M3 - Conference contribution

SP - 781

EP - 785

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

ER -

Access to Document