Electromigration lifetime enhancement of CoWP capped Cu interconnects by thermal treatment

Yumi Kakuhara, Naoyoshi Kawahara, Kazuyoshi Ueno, Noriaki Oda

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

In order to develop highly reliable Cu interconnects, temperature dependence of the electromigration (EM) lifetime of metal (CoWP) capped Cu interconnects is investigated. It is found that the EM lifetime is enhanced as the test temperature rise from 275 to 380°C. NH3 plasma treatment before the dielectric cap layer deposition on the CoWP capped Cu interconnects influenced the temperature dependence of EM lifetime, that is, the interconnects without the NH3 plasma treatment have longer EM lifetime than those with the NH3 plasma treatment at the higher test temperatures. In order to investigate the mechanism for this lifetime enhancement, micro-analysis and failure mode analysis were carried out. It is concluded that the Co alloying with Cu and the CoWP coverage repair due to Co diffusion at the high temperature lead to the EM lifetime enhancement.

Original languageEnglish
Pages (from-to)4475-4479
Number of pages5
JournalJapanese Journal of Applied Physics
Volume47
Issue number6 PART 1
DOIs
Publication statusPublished - 2008 Jun 13

Fingerprint

Electromigration
electromigration
Heat treatment
life (durability)
augmentation
Plasmas
Temperature
high temperature tests
Microanalysis
temperature dependence
Alloying
failure modes
Failure modes
microanalysis
caps
Repair
alloying
Metals
metals

Keywords

  • CoWP
  • Cu interconnects
  • Electromigration
  • Metal cap
  • Reliability

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Electromigration lifetime enhancement of CoWP capped Cu interconnects by thermal treatment. / Kakuhara, Yumi; Kawahara, Naoyoshi; Ueno, Kazuyoshi; Oda, Noriaki.

In: Japanese Journal of Applied Physics, Vol. 47, No. 6 PART 1, 13.06.2008, p. 4475-4479.

Research output: Contribution to journalArticle

Kakuhara, Yumi ; Kawahara, Naoyoshi ; Ueno, Kazuyoshi ; Oda, Noriaki. / Electromigration lifetime enhancement of CoWP capped Cu interconnects by thermal treatment. In: Japanese Journal of Applied Physics. 2008 ; Vol. 47, No. 6 PART 1. pp. 4475-4479.
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