Electromigration lifetime enhancement of CoWP capped Cu interconnects by thermal treatment

Yumi Kakuhara, Naoyoshi Kawahara, Kazuyoshi Ueno, Noriaki Oda

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Electromigration lifetime enhancement of CoWP capped Cu interconnects by thermal treatment'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy