Electronic circuit formation on flexible polymer surface processed by 1 MV accelerated hydrogen molecular ions

Hidetaka Hayashi, Wataru Furukawa, Hiroyuki Nishikawa

Research output: Contribution to journalArticle

Abstract

Focused Hydrogen Molecular Beam (FHIB) is an extended technology to utilize accelerated proton to modify material that is Proton Beam Writer (PBW) Watt (1999) [1]. The unique characteristic of these technologies is their capability to modify engineering plastics such as polyester and polyimide of no photosensitivity. These engineering plastics are key materials to compose electronic circuits and devices. Therefore we have been researching to apply these technologies for making functional devices in various applications. FHIB especially H3 + as the accelerating particle is proposed to improve productivity for industrial products Hayashi et al. (2017) [2]. In this report we show FHIB is properly applied to make distributed surface device of low profile that is useful to surface devices working at GHz to THz band applications. These bands are expected to provide the last communication carrier to fulfil the future wireless communication needs Oshima et al. (2017) [3]. We used 1MV accelerator to accelerate H3 + and irradiated on the FPC surface before development process of 5% KOH to make engravings and nanometer sized silver oxide paste was used to fill.

Original languageEnglish
Pages (from-to)76-80
Number of pages5
JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
Volume459
DOIs
Publication statusPublished - 2019 Nov 15

Fingerprint

hydrogen ions
molecular ions
Hydrogen
Networks (circuits)
Ions
polymers
Polymers
electronics
Silver oxides
Carrier communication
Plastics
Photosensitivity
Molecular beams
Proton beams
plastics
engraving
engineering
silver oxides
Polyimides
Particle accelerators

Keywords

  • Distributed surface device
  • Focused Hydrogen Molecular Beam (FHIB)
  • FPC
  • GHz
  • H
  • Industrial products
  • PET
  • Proton Beam Writer (PBW)
  • Silver oxide paste
  • THz

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Instrumentation

Cite this

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abstract = "Focused Hydrogen Molecular Beam (FHIB) is an extended technology to utilize accelerated proton to modify material that is Proton Beam Writer (PBW) Watt (1999) [1]. The unique characteristic of these technologies is their capability to modify engineering plastics such as polyester and polyimide of no photosensitivity. These engineering plastics are key materials to compose electronic circuits and devices. Therefore we have been researching to apply these technologies for making functional devices in various applications. FHIB especially H3 + as the accelerating particle is proposed to improve productivity for industrial products Hayashi et al. (2017) [2]. In this report we show FHIB is properly applied to make distributed surface device of low profile that is useful to surface devices working at GHz to THz band applications. These bands are expected to provide the last communication carrier to fulfil the future wireless communication needs Oshima et al. (2017) [3]. We used 1MV accelerator to accelerate H3 + and irradiated on the FPC surface before development process of 5{\%} KOH to make engravings and nanometer sized silver oxide paste was used to fill.",
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AU - Furukawa, Wataru

AU - Nishikawa, Hiroyuki

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AB - Focused Hydrogen Molecular Beam (FHIB) is an extended technology to utilize accelerated proton to modify material that is Proton Beam Writer (PBW) Watt (1999) [1]. The unique characteristic of these technologies is their capability to modify engineering plastics such as polyester and polyimide of no photosensitivity. These engineering plastics are key materials to compose electronic circuits and devices. Therefore we have been researching to apply these technologies for making functional devices in various applications. FHIB especially H3 + as the accelerating particle is proposed to improve productivity for industrial products Hayashi et al. (2017) [2]. In this report we show FHIB is properly applied to make distributed surface device of low profile that is useful to surface devices working at GHz to THz band applications. These bands are expected to provide the last communication carrier to fulfil the future wireless communication needs Oshima et al. (2017) [3]. We used 1MV accelerator to accelerate H3 + and irradiated on the FPC surface before development process of 5% KOH to make engravings and nanometer sized silver oxide paste was used to fill.

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